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- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Friday Video: SoC in tiny 500mg backpack transforms cockroach into radio-controlled exploration vehicle
- Friday Video: A different kind of fab with some very, very cool machines
- Friday Video: Get the latest skinny on the IPC-2581 open interchange standard for PCB design
- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
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- 39 low-cost boards for embedded Linux application development starting with Raspberry Pi. Want the list?
- 3-processor SoC for digital still cameras incorporates an ARM 1136J-S RISC processor core plus separate image and video processors
- Raspberry Pi + Canon = Camera Pi: ARM 11 and Linux hack of a Canon 5D Mk II DSLR
- 3D Thursday: Will water cooling for 3D IC assemblies ever be practical?
- GLOBALFOUNDRIES’ 28nm process comes in three flavors. Which is right for you?
- Ingenious architectural features allow ST to extract maximum performance from new microcontroller family based on ARM Cortex-M4. Cost: less than 6 bucks in 1000s
- Download a free PDF of the Mixed-signal Methodology Guide, Chapter 1: Design Trends and Challenges
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Category Archives: 20nm
Want to know what’s going to happen at 20nm, 14nm, and beyond? A few answers from Frank Leu of Cadence
Last week at the Global Technology Forum held at the Santa Clara Convention Center in Silicon Valley, Cadence VP of R&D Frank Leu discussed the things we’ve learned about 20nm IC manufacturing, what we are learning about 14nm, and where … Continue reading
By the numbers: 20nm (and 40nm, 32nm, 28nm, and 14nm) design to be discussed in technical detail at next week’s CDNLive! conference in Silicon Valley
There’s still time to register for CDNLive!, which is being held on March 13 and 14 at the Doubletree Hotel in San Jose, California so let me give you a few numbers to whet your appetite: 40nm, 32nm, 28nm, 20nm, … Continue reading
Friday Video: Common Platform Technology Forum reveals program agenda, rolls into Silicon Valley on March 14
The Common Platform partners are IBM, Samsung, and GLOBALFOUNDRIES and their annual Technology Forum rolls into Silicon Valley on March 14, so you have a couple of weeks to sign up. This short video from ChipEstimate.com gives you a good … Continue reading
GSA Silicon Summit to highlight cutting-edge IC technologies: 3D IC assembly, FinFETs, and SOI. April 26, Silicon Valley
The Global Semiconductor Alliance (GSA) is sponsoring a half-day event that will drill down into three of the leading-edge IC manufacturing technologies of the coming decade: 3D (and 2.5D) IC assembly, FinFETs (or Tri-gate FETs), and silicon-on-insulator (SOI) substrates. The … Continue reading
Registration for CDN Live—the 2-day technical conference for Cadence users being held on March 13 and 14 in San Jose—has just gone <er> live. Before I give you the link, I wanted to let you know about some of the … Continue reading
Last night, half a dozen ICCAD panelists attacked the topic “2020 Vision: What the recent history of EDA will look like in nine years.” That’s such a convoluted and hard-to-parse title that the panelists chose to discuss the state of … Continue reading
Power, Performance, Cost. FDSOI lets you pick any three. Want proof? How about an ARM Cortex-M0 processor core example?
Last week, the first session of the International SoC Conference focused on FDSOI (fully depleted silicon-on-insulator) IC fabrication. Now if your thinking resembles mine before I watched this presentation, you think that FDSOI is an advanced IC-fabrication process that gives … Continue reading
Semico just released its latest wafer demand report for 2011 and the top-line conclusion isn’t wonderful but it’s not horrible either. Unit sales and wafer demand in the electronics industry will be up for the year but falling ASPs mean … Continue reading
Friday Video: What does it take to get to 20nm? Samsung’s VP of Foundry North America Ana Hunter explains
Samsung has been pushing IC process technology about as hard as any company in the business. It’s foundry business is operating at 65nm and 32/28nm with a 20nm process node in development. (See my recent blog “Samsung 20nm test chip … Continue reading
Want some more details about the Samsung 20nm test chip? Here’s your chance: ARM TechCon 2011 on October 25
Later this month, you have the opportunity of attending the ARM TechCon 2011 conference being held in the Santa Clara Convention Center in California. Tuesday, October 25 is dedicated the many different aspects of advanced to SoC design and the … Continue reading
One week ago, I described some of the 20nm process node benefits and challenges discussed in Wei Lii Tan’s presentation at the recent Global Technology Conference. (See “Just how high is the 20nm design mountain of challenges?”) Now Richard Goering … Continue reading
Click on over to Richard Goering’s latest post about the Cadence 20nm presentation made last week at the Global Technology Conference. Goering goes into even greater technical detail that I did in my post on the talk (see “Just how … Continue reading