Category Archives: AMS

20nm design: What have we learned so far?

Even if you are not currently considering 20nm design, you owe it to yourself to download and read a new 9-page White Paper titled “A Call to Action: How 20nm Will Change IC Design” to learn about some tectonic shifts … Continue reading

Posted in 20nm, 28nm, AMS, Analog, ARM, Design Abstraction, EDA360, Silicon Realization, Verification | Tagged , , , , , , , | 1 Comment

Freescale demonstrates first-pass Kinetis L silicon at Design West (The conference formerly known as the Embedded Systems Conference)

Two weeks ago, ARM introduced its new low-end Cortex-M0+ 32-bit processor core. At the same time, Freescale announced that it was planning on introducing a new line of Kinetis “L” low-power microcontrollers based on the ARM Cortex-M0+ processor. (See “How … Continue reading

Posted in 65nm, AMS, ARM, Cortex-M0, EDA360, Firmware, Silicon Realization, SoC, SoC Realization | Tagged , , | Leave a comment

ISQED: Why does a trailing-edge digital IC process = a leading-edge analog IC process? TI’s Dr. Venu Menon lays bare the secrets of the analog IC business

“What can you do with bits?” asked Dr. Venu Menon, VP of Analog Technology Development at Texas Instruments at the beginning of his keynote talk at last week’s ISQED. Then he answered his own question: “Nothing without analog,” because analog … Continue reading

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Free Webinar on December 8: Mixed-signal and low-power analysis and verification techniques

As the size and complexity of mixed-signal designs have grown, so has the verification task. Designers face the challenging task of verifying complex power, performance, and functionality specifications as well as validating analog and digital interactions over a broad range … Continue reading

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Cadence collaboration produces TSMC Reference Flow 12.0 and Analog-Mixed-Signal (AMS) Reference Flow v2.0 for 28nm including ESL and 3D TSV DFT support

Today’s the first day of DAC and Cadence is sponsoring a 20nm development panel and lunch at the Omni Hotel adjacent to the San Diego Convention Center. At the same time, Cadence and TSMC have been cooperating on the TSMC … Continue reading

Posted in 3D, AMS, DAC, EDA360, imec, Silicon Realization, TSMC, TSV | Leave a comment