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Recent Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Friday Video: SoC in tiny 500mg backpack transforms cockroach into radio-controlled exploration vehicle
- Friday Video: A different kind of fab with some very, very cool machines
- Friday Video: Get the latest skinny on the IPC-2581 open interchange standard for PCB design
- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
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Top Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Ingenious architectural features allow ST to extract maximum performance from new microcontroller family based on ARM Cortex-M4. Cost: less than 6 bucks in 1000s
- My workbench from 1978 highlighted in EETimes as one of engineering’s messiest desks
- Friday Video (Musical Bonus): What does it take to play the Dr. Who theme song with a pair of Tesla coils, a Faraday cage, and two unlucky audience members?
- Asymmetric, dual-core NXP LPC4300 microcontrollers split tasks between ARM Cortex-M4 and -M0 cores, cost $3.75 and up
- Welcome to 3D Week: Why is 3D important? Now? The memory wall, heat, and disposable sensors
- 3D Thursday: Generation-jumping 2.5D Xilinx Virtex-7 2000T FPGA delivers 1,954,560 logic cells using 6.8 BILLION transistors (UPDATED!)
- Want a peek at a possible Qualcomm 3D IC roadmap?
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Category Archives: DAC
3D Thursday: Wide I/O and TSVs have a ripple effect on the DRAM controller. Who knew?
Currently, the JEDEC Wide I/O DRAM specification looks to be the biggest driving force behind the adoption of 3D IC assembly. The 512-bit data maw of a Wide I/O SDRAM provides high bandwidth with low power levels, both excellent arguments … Continue reading
Posted in 2.5D, 3D, DAC, EDA360, IP, Silicon Realization, SoC, SoC Realization, System Realization, TSV, Wide I/O
Tagged DRAM, JEDEC, Marc Greenberg, Mobile device, SDRAM, Wide I/O
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Friday Video: EDA360 Insider talks HW/SW Codesign and Xilinx Zynq Dev Board with ChipEstimate.TV at DAC
I spent a few minutes with Sean O’Kane of ChipEstimate.TV at DAC earlier this month talking about system design, HW/SW codesign, and the new Avnet Dev Board for the Xilinx Zynq-7000 EPP. Here’s the video:
Posted in DAC, EDA360, Silicon Realization, SoC, SoC Realization, System Realization
Tagged Xilinx, Zynq
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This just out from DAC 2012: video interview with EDA bloggers Goering and Leibson on IP subsystems, 20nm, and more
Want to know what’s going to happen at DAC 2012? Oh, wait, that was a couple of weeks ago. Which is how long it took to get post this video of EDA bloggers Richard Goering and Steve Leibson from a … Continue reading
Posted in 20nm, 28nm, DAC, EDA360, Silicon Realization, SoC, SoC Realization, System Realization
Tagged DAC, Design Automation Conference, Richard Goering, Steve Leibson
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3D Thursday: The “King of 3D ICs” (Herb Reiter) speaks to his subjects—“Learn to work together”
Mr. 3D IC—aka Herb Reiter—spoke to an attentive group of packaging experts about the state of 3D IC technical and business development today at a MEPTEC luncheon held at the “luxurious” Biltmore Hotel in cental Silicon Valley. I’ve written about … Continue reading
Posted in 2.5D, 3D, DAC, EDA360, Low Power, Packaging, Silicon Realization, SoC, SoC Realization, System Realization, Wide I/O
Tagged 2.5D, 3D, Herb Reiter, IBM, Reiter, Three-dimensional integrated circuit, TSMC, Xilinx
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Tuesday DAC Photos: Cool Shoes and the transit of Venus across the Sun
Here are two photos from today’s DAC in San Francisco. The first photo is a pair of shoes worn by Susan Peterson of Cadence. We were told to wear black shoes for our show “outfit.” Too bad no one said … Continue reading
Gary Smith proposes a 3-layer taxonomy for platform-based SoC design—Live from DAC 2012
EDA’s chief analyst Gary Smith is high on IP subsystems—big ones. Only Gary calls them platforms. Why is Smith so enthusiastic? Because, as he says, he was wrong last year in his estimates of how much it costs to develop … Continue reading
Posted in DAC, IP, SoC, SoC Realization, System Realization, Texas instruments
Tagged ARM, Armada, Design Compiler, Marvell, Nvidia, OMAP, Qualcomm, Snapdragon, Tegra
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DAC 2012: Get answers to all of your EDA questions at 78 Cadence demo suite slots
Next week (Monday, Tuesday, and Wednesday) you can get all of your EDA questions answered at the Cadence DAC demo suites. There are 78 demos over the three days covering the following EDA topics: Mixed-signal and low-power design RTL-to-GDSII design … Continue reading
Posted in DAC, EDA360, Low Power, Mixed Signal, pcb, Silicon Realization, SoC, SoC Realization, System Realization, TLM, Verification, VIP, Virtual Prototyping
Tagged DAC, EDA, IC design, pcb, synthesis, verification
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Beyond breakfast: An ethical bribe for attending “The Path to Yielding at 2(x)nm and Beyond” at DAC
Yesterday, I wrote about a terrific discussion panel about the challenges of 20nm design at DAC. I am moderating the panel and there will be speakers from the Common Platform partners including IBM, Samsung, GLOBALFOUNDRIES (just confirmed!), and Cadence. (See … Continue reading
Posted in 20nm, DAC, EDA360, Silicon Realization
Tagged 20nm, Cadence, Common Platform, GlobalFoundries, IBM, Samsung
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At DAC: The path to 20nm includes breakfast on Wednesday, June 6
Want to know how to get to 20nm? Want to know why? Want breakfast at DAC on June 6? This is indeed your lucky day because you can get it all done at a special DAC breakfast panel titled “The … Continue reading
Smart analog/mixed-signal IC designs are—er—smarter. Learn how to stuff a 32-bit ARM Cortex-M core into an AMS design at DAC. Lunch included
In these days of the SoC, one chip has to do it all. That means both analog and digital processing. Now you can get a first-hand look at how successful design teams have integrated ARM Cortex-M processor cores in their … Continue reading
Posted in ARM, Cortex-M0, Cortex-M4, DAC, Mixed Signal, Silicon Realization, SoC, SoC Realization
Tagged AMS, ARM architecture, ARM Cortex-M, Moscone Center, San Francisco, System-on-a-chip
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FREE DAC 2012 Exhibit 3-day passes. Limited quantity. Time-limited offer. Get ‘em NOW!
Want to go see the latest EDA offerings on the DAC exhibit floor but you (or your boss) can’t spring for the cash? Bummer. Atrenta, Cadence, and Springsoft feel your pain and once more, the three amigos have partnered to … Continue reading
Is there a Denali Party 2012? The most important question at DAC, answered.
Yes, Virginia, there is a Denali party this year at DAC. As DAC returns to San Francisco in 2012, the Denali Party by Cadence returns to an extremely popular party venue—Ruby Skye—which bills itself as San Francisco’s Number One Nightclub. … Continue reading
$2.50 buses from Silicon Valley to DAC! FREE WiFi. But you need to get a ticket. Hurry. Seats are limited
DAC takes place in San Francisco at Moscone Center. You are in Silicon Valley. It’s a classic Point A to Point B problem. Solve the problem for pocket change this year. Buses with FREE on-board WiFi will run from the … Continue reading
What will EDA and chip design look like in the year 2020? Prognostications from the ICCAD panel
Last night, half a dozen ICCAD panelists attacked the topic “2020 Vision: What the recent history of EDA will look like in nine years.” That’s such a convoluted and hard-to-parse title that the panelists chose to discuss the state of … Continue reading
Posted in 20nm, 28nm, 3D, DAC, Design Abstraction, EDA360, Silicon Realization, SoC, SoC Realization, System Realization
Tagged TSMC, Xilinx Virtex-7 2000T FPGA
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Latest episode of Hogan’s Heroes at DAC 2011 answers question: “What do EDA’s customers want?”
Jim Hogan’s annual “Hogan’s Heroes” DAC Pavilion Panel rocked as usual. This year, Hogan invited three panelists: Grant Pierce (Sonics), Jack Harding (eSilicon), and Ajoy Bose (Atrenta). All four of these people spend a lot of time thinking about the … Continue reading
Posted in DAC, EDA360, Silicon Realization, SoC Realization, System Realization
Tagged 48DAC, DAC 2011, Hogan's Heroes, Jim Hogan
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Perennial talent competitor Dave Crohn wins “EDA360’s got Talent” competition at the DAC 2011 Denali Party
Persistence paid off on Tuesday night as Dave Crohn (Broadcom) sang Bryan Adams’ 1984 hit song “Summer of ‘69” to win the “EDA360’s Got Talent” competition at the Denali Party sponsored by Cadence this year at DAC. Crohn’s sleeveless t-shirt … Continue reading
Globalfoundries, LSI Corp, and Broadcom help Editorial Director Ed Sperling give the industry a low-power report card. How did we score?
On Wednesday at DAC’s show-floor Pavilion, Low-Power Engineering’s Editorial Director Ed Sperling chaired a panel with the intent of giving the industry a report card on its low-power engineering efforts. Along with Sperling on the Pavilion platform were Andrew Brotman, … Continue reading
Posted in DAC, EDA360, Low Power, Silicon Realization, SoC Realization, System Realization
Tagged Broadcom, GlobalFoundries, LSI Corp
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EDA360 meets DAC360: Survival tips for DAC 2011
TheEDA360 Evangelist (and EDA360 Insider blogger) was at the DAC360 video booth today with EETimes’ Brian Fuller. Here are some video survival tips and industry overviews on video.
Posted in DAC, EDA360, Uncategorized
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How many engineers does it take to spin a chip?
The title of this blog entry paraphrases a very old joke category about light bulbs but the topic is serious because it goes to the heart of the electronic industry’s profitability. EDA analyst and ur chip-design guru Gary Smith discussed … Continue reading
Posted in DAC, EDA360, Firmware, Silicon Realization, SoC Realization, System Realization
Tagged Gary Smith
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Video: Gary Smith and the Full Disclosure Blues Band Revisited open the DAC 2011 show floor playing “Goin’ Down”
I’m not sure if this song was supposed to be a comment on the future outlook for EDA, because Gary Smith showed his second longest list of “companies to see at DAC” ever (30 companies) and forecast climbing industry revenues … Continue reading
Cadence collaboration produces TSMC Reference Flow 12.0 and Analog-Mixed-Signal (AMS) Reference Flow v2.0 for 28nm including ESL and 3D TSV DFT support
Today’s the first day of DAC and Cadence is sponsoring a 20nm development panel and lunch at the Omni Hotel adjacent to the San Diego Convention Center. At the same time, Cadence and TSMC have been cooperating on the TSMC … Continue reading
Posted in 3D, AMS, DAC, EDA360, imec, Silicon Realization, TSMC, TSV
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What can you do in 20nm? Now? Today? Find out at DAC. Monday. Lunch included. Free.
OK. Here’s the deal. Cadence wants you to know about the true bleeding edge in Silicon Realization. The ASIC/SoC silicon frontier’s at 20nm. FYI: 28nm is already a day late and a process node short (thanks Richard G!). Want to … Continue reading
Posted in ARM, DAC, EDA360, Silicon Realization
Tagged 20nm, Samsung, STMicroelectronics
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EDA360 goes live for DAC!
DAC is slightly more than a week away. This year, there will be a live feed from the exhibit floor with interviews hosted by EETimes’ Brian Fuller. Look for a couple of guest hosts: long-time EDA journalist and now Cadence … Continue reading
Posted in DAC, EDA360
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EDA360 gets an app
One of EDA360’s core messages is that apps are now firmly in the driver seat with respect to product and chip development. So it makes sense for EDA360 to have an app, doesn’t it? Now there is one. It’s for … Continue reading
Posted in Apps, DAC, EDA360
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20nm or free lunch on Monday at DAC? How about both?
Late, late notice. I know. Mea culpa. But you’ll forgive me when you hear what’s in store for you at DAC on Monday. Cadence is organizing a panel on 20nm technology that includes lunch. How cool is that? The panelists … Continue reading
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