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- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Friday Video: SoC in tiny 500mg backpack transforms cockroach into radio-controlled exploration vehicle
- Friday Video: A different kind of fab with some very, very cool machines
- Friday Video: Get the latest skinny on the IPC-2581 open interchange standard for PCB design
- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
EDA360 Tag Cloud2.5D 3D 3D IC 20nm 28nm 32nm 40nm Agilent Altera AMD Analog Android Apple ARM ARM architecture ARM Cortex-A15 ASIC Broadcom Cadence Canon Cortex Cortex-A15 Cortex-M0 DAC Dave Jones DDR3 DDR4 Double Patterning EDA EDPS Field-programmable gate array FinFET Flash Flash memory FPGA Freescale Freescale Semiconductor GlobalFoundries Google IBM Intel IP iPad iPhone JEDEC Jim Hogan Kinect Linux Low Power Lytro microcontroller Micron Microsoft Mixed Signal Multi-core processor Nvidia OrCAD pcb Printed circuit board Qualcomm Robot Samsung SDRAM Snapdragon SoC STMicroelectronics SystemC Texas Instruments TI TSMC USB verification video Wide I/O Xilinx
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Ingenious architectural features allow ST to extract maximum performance from new microcontroller family based on ARM Cortex-M4. Cost: less than 6 bucks in 1000s
- 39 low-cost boards for embedded Linux application development starting with Raspberry Pi. Want the list?
- 3D Week: Wide I/O SDRAM, Network on Chip, Multicore, TSV, Asynchronous Logic—3D SoC stack from CEA-Leti and ST-Ericsson hits all the advanced notes. Can you say “Tour de Force”?
- Xilinx Vivado Design Suite brings SoC design style to advanced-node FPGA development
- 3D Thursday: More on the Xilinx Virtex 7 with 2.5D tiling. Wave of the future or stopgap measure?
- Want more information on the ARM Cortex-M0+ processor core?
- 3D Thursday (early): Steve’s Improbable History of 3D ICs? Six decades of 3D electronic packaging
- Friday Video: A blast from the past. Handifax 1000 promo video from mid 1990s shows how far we’ve come
- GLOBALFOUNDRIES’ 28nm process comes in three flavors. Which is right for you?
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Category Archives: Silicon Realization
There’s a strange little high-rise hotel called the Biltmore in the center of Silicon Valley at the intersection of the Montague Expressway and Highway 101. It’s going to be the site of this year’s “Roadmaps for Multi Die Integration” conference … Continue reading
Would you like a guide to several new microcontrollers based on the ARM Cortex-M series of processor cores?
Alban Rampon has just published a guide to many new developments surrounding the ARM Cortex-M series of microcontroller cores. The guide includes a discussion of Freescale Kinetis L microcontrollers based on the ARM Cortex-M0+ core; discussions of microcontrollers based on … Continue reading
3D Thursday: Produce cost-effective 2.5D and 3D devices. Attend the Known Good Die conference, November 15
Robert Patti, Chief Technical Officer and VP of Design Engineering at Tezzaron Semiconductor is the just-announced speaker at the Known Good Die conference being held on November 15 in Santa Clara, CA. His topic: Using Repair & Redundancy with KGD … Continue reading
Have you ever wondered how we got from a world solely occupied by semiconductor vendors with their own fabs to today’s hodgepodge of IDMs (independent device manufacturers, the new name for the old-style “semiconductor vendor”), fab-lite vendors, and fables vendors? … Continue reading
3D Thursday: Intel Penwell SoC for mobile phones employs POP (package-on-package) LPDDR2 SDRAM to reduce power
Wednesday at the Hot Chips 24 conference, Rumi Zahir of Intel discussed the company’s Penwell SoC designed for cell phone handsets. The SoC is employed in the Medfield cellular handset design and it’s based on the Intel Atom x86 processor … Continue reading
Today at the Hot Chips 24 conference, George Chrysos discussed the Intel MIC (Many Integrated Core) architecture of the Knights Bridge chip, to be formally called the Intel Xeon Phi coprocessor. This chip runs Linux, but it’s designed to act … Continue reading
EDA analyst and SemiWiki writer Paul McLellan published an article on 20nm design last week. It’s based on the Cadence White Paper on the same topic. You can see Paul’s article here. The Cadence 20nm White Paper is here.
A 1-day workshop on Analog and Mixed-Signal Design Automation will be held on November 8 in conjunction with ICCAD in Silicon Valley. It’s no secret that advanced-node process scaling makes all IC design more complex and more challenging—even more so … Continue reading
Daniel Nenni has just posted a very brief history of the SoC, with heavy emphasis on SoCs for mobile products. The emphasis is probably warranted because mobile designs really have driven SoC design for the past decade. One of the … Continue reading
Want to know why you need to be at Memcon this year? Here’s Denali Software founder Sanjay Srivastava to tell you why: Now go and sign up! It’s a free ticket and includes breakfast, lunch, and some goodies—not to mention … Continue reading
A couple of days ago, I let you know that Cadence had just published a comprehensive book on mixed-signal SoC design and verification. The book’s title is the “Mixed-Signal Methodology Guide,” written by the top mixed-signal design experts from across … Continue reading
Samsung Exynos 5 Dual mobile processor features two 1.7GHz ARM Cortex-A15 processors, a WQXGA display controller, and two LPDDR3 controllers to feed ‘em
This past weekend, the Web was abuzz with last week’s unveiling of Samsung’s Exynos 5 Dual mobile processor. This SoC features two 1.7GHz ARM Cortex-A15 processors rather than the previous Exynos generation Dual mobile processor that incorporated two 1.4GHz ARM … Continue reading
New Mixed-Signal Methodology Guide provides design, verification and implementation methodologies for advanced mixed-signal designs
Cadence has just published the “Mixed-Signal Methodology Guide,” which provides an overview of design, verification and implementation methodologies for advanced mixed-signal designs based on recommendations from the book’s co-authors—top mixed-signal design experts from across the industry including authors from Boeing, … Continue reading
Bob Zeidman, founder and president of Zeidman Consulting, has just published the third edition of his book “Introduction to Verilog.” It was first published a dozen years ago and is based on the Verilog seminars that Zeidman has given at … Continue reading
A new blog published today on the ARM Web site titled “How do you take an ARM POP up one more notch?” describes a very recent collaboration between ARM and Cadence to enhance the ARM POP IP, which helps any … Continue reading
What are the key advantages of moving to 20nm? There are three primary reasons why we are seeing more system and semiconductor companies consider 20nm: performance, power, and area (PPA). Essentially, this is a “next-node” answer, which is still as … Continue reading
In an unusual press release, network processor vendor Cavium has revealed plans for Project Thunder,” which will develop a family of multi-core SoCs based on the 64-bit ARM v8 processor architecture. The processors will be full-custom cores based on the … Continue reading
Currently, the JEDEC Wide I/O DRAM specification looks to be the biggest driving force behind the adoption of 3D IC assembly. The 512-bit data maw of a Wide I/O SDRAM provides high bandwidth with low power levels, both excellent arguments … Continue reading
Last week, Brian Bailey published an interview with Professor Madhavan Swaminathan who is the Director of the Interconnect and Packaging Center (IPC) at Georgia Tech in Atlanta. The topic of the interview was cooling of 3D IC devices. It’s no … Continue reading
If you’re looking for simplified explanations of technical topics, few people write them as well as Clive “Max” Maxfield. His simplified 3-page explanation of 3D IC assembly is here. (Note: Registration needed to go past page 1, unfortunately.)
Veteran EDA industry watcher Peggy Aycinena visited MIT recently and spoke with Professor Srini Devadas about a manycore processor project called “Angstrom.” The purpose of the project is to develop massively parallel hardware—as in 1024 processors—to explore better ways of … Continue reading
Today, ARM and TSMC announced a multi-year deal to develop a 64-bit ARM v8 processor “beyond” the 20nm node using FINfets. The collaboration includes the ARMv8 architecture, ARM Artisan physical IP, and TSMC’s FinFET process technology. The target of this … Continue reading
Friday Video: Luigi Capodieci, a fellow at GLOBALFOUNDRIES, talks 20nm and below, EUV, FINFETs, and the state of the foundry business
Be sure to watch this excellent 13-minute interview done by Mark LePedus starring Luigi Capodieci, a fellow with GLOBALFOUNDRIES, to get a close-up-and-personal look at the state of the foundry business (it’s not dying), 20nm design, EUV in the wings, … Continue reading
Yesterday, Micron announced volume production of a new memory device containing one 1Gbit PCM (phase-change memory) die and one 512Mbit LPDDR2 SDRAM die. The two die reside in the device package as stacked die, with wire-bonded interconnect. This is a … Continue reading
Well this is a strange analogy that would never occur to me. Daniel Nenni in his new SemiWiki post compares the 20nm process node to—of all things—mango beer. He writes: “As it turns out, the mango beer is very good! … Continue reading