Search EDA360 Insider
Hey!!! Subscribe now to the EDA360 Insider!
-
Recent Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Friday Video: SoC in tiny 500mg backpack transforms cockroach into radio-controlled exploration vehicle
- Friday Video: A different kind of fab with some very, very cool machines
- Friday Video: Get the latest skinny on the IPC-2581 open interchange standard for PCB design
- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
EDA360 Tag Cloud
- 2.5D
- 3D
- 3D IC
- 20nm
- 28nm
- 32nm
- 40nm
- Agilent
- Altera
- AMD
- Analog
- Android
- Apple
- ARM
- ARM architecture
- ARM Cortex-A15
- ASIC
- Broadcom
- Cadence
- Canon
- Cortex
- Cortex-A15
- Cortex-M0
- DAC
- Dave Jones
- DDR3
- DDR4
- Double Patterning
- EDA
- EDPS
- Field-programmable gate array
- FinFET
- Flash
- Flash memory
- FPGA
- Freescale
- Freescale Semiconductor
- GlobalFoundries
- IBM
- Intel
- IP
- iPad
- iPhone
- JEDEC
- Jim Hogan
- Kinect
- Linux
- Low Power
- Lytro
- microcontroller
- Micron
- Microsoft
- Mixed Signal
- Multi-core processor
- Nvidia
- OrCAD
- pcb
- Printed circuit board
- Qualcomm
- Robot
- Samsung
- SDRAM
- Snapdragon
- SoC
- STMicroelectronics
- SystemC
- Texas Instruments
- TI
- TSMC
- USB
- verification
- video
- Wide I/O
- Xilinx
Top Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- The DDR4 SDRAM spec and SoC design. What do we know now?
- Who wants more technical detail on the Altera SoC FPGA? Altera says…you!
- 3D Thursday (early): Steve’s Improbable History of 3D ICs? Six decades of 3D electronic packaging
- ARM furthers its “cover the earth” strategy with introduction of R5 and R7 core variants for fast, real-time, deterministic SoC applications
- ARM adds ARM Cortex-A15 and Cortex-R5 models to Fast Models 6.1 release, making these cores immediately available to System Realization teams
- 3D Thursday: CEA-Leti launches Open 3D IC assembly partnership program
Download the EDA360 Vision Paper here:
Tag Archives: 180nm
Where is the mainstream IC process technology today? 28nm? 40nm? 65nm?
EDA companies like Cadence focus on developing the latest tools for bleeding-edge process technologies—28nm and 20nm today—and that’s been the emphasis of my blog posts from last week’s Global technology Conference (GTC). However, there was one panel at the conference … Continue reading
Posted in EDA360, Globalfoundries, Silicon Realization
Tagged 130nm, 180nm, 20nm, 28nm, 32nm, 40nm, 65nm, 90nm
Leave a comment
EDA360 Insider 