Search EDA360 Insider
Hey!!! Subscribe now to the EDA360 Insider!
-
Recent Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Friday Video: SoC in tiny 500mg backpack transforms cockroach into radio-controlled exploration vehicle
- Friday Video: A different kind of fab with some very, very cool machines
- Friday Video: Get the latest skinny on the IPC-2581 open interchange standard for PCB design
- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
EDA360 Tag Cloud
- 2.5D
- 3D
- 3D IC
- 20nm
- 28nm
- 32nm
- 40nm
- Agilent
- Altera
- AMD
- Analog
- Android
- Apple
- ARM
- ARM architecture
- ARM Cortex-A15
- ASIC
- Broadcom
- Cadence
- Canon
- Cortex
- Cortex-A15
- Cortex-M0
- DAC
- Dave Jones
- DDR3
- DDR4
- Double Patterning
- EDA
- EDPS
- Field-programmable gate array
- FinFET
- Flash
- Flash memory
- FPGA
- Freescale
- Freescale Semiconductor
- GlobalFoundries
- IBM
- Intel
- IP
- iPad
- iPhone
- JEDEC
- Jim Hogan
- Kinect
- Linux
- Low Power
- Lytro
- microcontroller
- Micron
- Microsoft
- Mixed Signal
- Multi-core processor
- Nvidia
- OrCAD
- pcb
- Printed circuit board
- Qualcomm
- Robot
- Samsung
- SDRAM
- Snapdragon
- SoC
- STMicroelectronics
- SystemC
- Texas Instruments
- TI
- TSMC
- USB
- verification
- video
- Wide I/O
- Xilinx
Top Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- 3-processor SoC for digital still cameras incorporates an ARM 1136J-S RISC processor core plus separate image and video processors
- 3D Thursday: Micron’s 3D Hybrid Memory Cube delivers more DRAM bandwidth at lower power and in a smaller form factor using TSVs
- Collaboration is key to making DFM work at 28nm and below
- 3D Thursday: A look at some genuine 3D NAND cells, courtesy of Micron
- Friday Video: How many hardware/software integration lessons can you absorb in 34 minutes?
- The DDR4 SDRAM spec and SoC design. What do we know now?
- Intel’s Knut Grimsrud explains how to get another 20x improvement in SSD performance
- Where is the mainstream IC process technology today? 28nm? 40nm? 65nm?
- What’s it take to design DDR4 into your next SoC? Newly released DFI 3.0 Spec opens the flood gates for DDR4 design
Download the EDA360 Vision Paper here:
Tag Archives: A15
ARM big.LITTLE multicore IP architecture wins a Microprocessor Report Analysts’ Choice Award
This week in the Microprocessor Report, the Linley Group announced its Analysts’ Choice Award winners and declared the ARM big.LITTLE multicore IP architecture as the best processor IP of the year: “Designed to extend battery life by up to 70%, … Continue reading
Posted in ARM, Cortex-A15, Cortex-A7, EDA360, IP, Low Power, Packaging, Silicon Realization, SoC, SoC Realization
Tagged A15, A7, ARM, Cortex, Microprocessor Report
Leave a comment
ARM adds ARM Cortex-A15 and Cortex-R5 models to Fast Models 6.1 release, making these cores immediately available to System Realization teams
ARM’s latest release of its Fast Models (v6.1) adds support for the ARM Cortex-A15 and Cortex-R5 processor cores. Fast Models are a real boon to System Realization teams because they provide a very easy way to test out large amounts … Continue reading
Posted in ARM, CDNLive!, EDA360, System Realization
Tagged A15, ARM, ARM architecture, Cortex-A15, Multi-core processor
Leave a comment
EDA360 Insider 