Tag Archives: Advanced Micro Devices

Hot Chips 24 in August will feature a 3D tutorial plus details of new chips from AMD, Intel, Xilinx, and more

This year’s Hot Chips conference takes place on August 24-29 in a new venue: The Flint Center for the Performing Arts in Cupertino, CA. On the afternoon of August 27, there’s a die-stacking tutorial with presentations from AMD, Amkor, SK … Continue reading

Posted in EDA360 | Tagged , , , , , , | Leave a comment

AMD’s new Trinity APU (Accelerated Processing Unit) for laptops/notebooks is a poster child for IP-centric SoC design

Yesterday, AMD introduced its second generation of A-series APUs (Accelerated Processing Units) that combine two to four Piledriver x86 microprocessor cores—each with 2Mbytes of L2 cache memory—with a Radeon 7000 GPU (Graphics Processing Unit), an HD Media Accelerator, a display … Continue reading

Posted in 32nm, EDA360, Silicon Realization, SoC, SoC Realization | Tagged , , , , , , , | Leave a comment

You have six weeks to wait for the Semico IP Summit. What will you do until then?

Use of IP in the design of SoCs has long been a fact. The very name “SoC” says that you’re using microprocessor IP at the very least. With that comes memory IP, memory controller IP, interface IP, analog IP, etc. … Continue reading

Posted in EDA360, IP, SoC Realization | Tagged , , , , , , | Leave a comment

PCI Express takes on Apple/Intel Thunderbolt and 16 Gtransfers/sec at PCI SIG while PCIe Gen 3 starts to power up

Two articles from EETimes give an exciting picture for PCI Express’ short- and long-term future. On the most immediate front, 23 adapter cards and 19 systems from PC and peripheral makers participated in the most recent PCIe Gen 3 plugfests. … Continue reading

Posted in EDA360, Silicon Realization, SoC Realization, System Realization | Tagged , , , , , , | Leave a comment