Search EDA360 Insider
Hey!!! Subscribe now to the EDA360 Insider!
-
Recent Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Friday Video: SoC in tiny 500mg backpack transforms cockroach into radio-controlled exploration vehicle
- Friday Video: A different kind of fab with some very, very cool machines
- Friday Video: Get the latest skinny on the IPC-2581 open interchange standard for PCB design
- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
EDA360 Tag Cloud
- 2.5D
- 3D
- 3D IC
- 20nm
- 28nm
- 32nm
- 40nm
- Agilent
- Altera
- AMD
- Analog
- Android
- Apple
- ARM
- ARM architecture
- ARM Cortex-A15
- ASIC
- Broadcom
- Cadence
- Canon
- Cortex
- Cortex-A15
- Cortex-M0
- DAC
- Dave Jones
- DDR3
- DDR4
- Double Patterning
- EDA
- EDPS
- Field-programmable gate array
- FinFET
- Flash
- Flash memory
- FPGA
- Freescale
- Freescale Semiconductor
- GlobalFoundries
- IBM
- Intel
- IP
- iPad
- iPhone
- JEDEC
- Jim Hogan
- Kinect
- Linux
- Low Power
- Lytro
- microcontroller
- Micron
- Microsoft
- Mixed Signal
- Multi-core processor
- Nvidia
- OrCAD
- pcb
- Printed circuit board
- Qualcomm
- Robot
- Samsung
- SDRAM
- Snapdragon
- SoC
- STMicroelectronics
- SystemC
- Texas Instruments
- TI
- TSMC
- USB
- verification
- video
- Wide I/O
- Xilinx
Top Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Download a free PDF of the Mixed-signal Methodology Guide, Chapter 1: Design Trends and Challenges
- Ingenious architectural features allow ST to extract maximum performance from new microcontroller family based on ARM Cortex-M4. Cost: less than 6 bucks in 1000s
- 3D Thursday: Intel and FinFETs (Tri-Gate transistors)—a different kind of 3D
- ARM adds ARM Cortex-A15 and Cortex-R5 models to Fast Models 6.1 release, making these cores immediately available to System Realization teams
- 3-processor SoC for digital still cameras incorporates an ARM 1136J-S RISC processor core plus separate image and video processors
- 3D Thursday (early): Steve’s Improbable History of 3D ICs? Six decades of 3D electronic packaging
- Friday Video: Apple iPhone 4S teardown by iFixIt
- Free Webinar on December 8: Mixed-signal and low-power analysis and verification techniques
- EDA360 and the brand new Hewlett-Packard 15C Limited Edition RPN pocket scientific calculator
Download the EDA360 Vision Paper here:
Tag Archives: Amazon
What’s unique about the new $199 Android-based Amazon Kindle Fire tablet?
Is it the toughened Gorilla-Glass screen? Nope. Is it the dual-core processor? Nope. Is it the “cloud-accelerated” Amazon Silk browser? Nope. Is it the 8-hour battery life? Certainly not. Is it the unified email inbox? Getting warmer. Is it the … Continue reading
Posted in Android, Ecosystem, EDA360, System Realization
Tagged Amazon, Kindle, Kindle Fire, OMAP, TI
Leave a comment
Amazon issues apology and detailed technical explanation for EC2 cloud failure—more food for thought for the EDA cloud
Amazon issues apology and explanation for EC2 cloud failure—more food for thought for the EDA cloud In a long letter, Amazon has issued a complex explanation of the events behind the disastrous, multi-day failure of one zone it its EC2 … Continue reading
What does Amazon’s multiday cloud outage mean for EDA cloud services?
Amazon’s Elastic Compute Cloud (EC2) is perhaps the most famous cloud utility on the planet and it has suffered a multi-day outage that is just finally clearing on Sunday, April 24 (Easter Sunday, by coincidence, see the Amazon AWS dashboard). There … Continue reading
