Tag Archives: Amkor

3D Thursday: Lessons learned from the IMEC’s 3D DRAM-on-logic chip design work

I recently covered the groundbreaking WIOMING 3D chip design done by CEA-Imec in conjunction with ST-Ericsson. (See “3D Week: Wide I/O SDRAM, Network on Chip, Multicore, TSV, Asynchronous Logic—3D SoC stack from CEA-Leti and ST-Ericsson hits all the advanced notes. … Continue reading

Posted in 2.5D, 3D, EDA360, imec, SoC, SoC Realization | Tagged , , , , , , , , , , , , , , , | Leave a comment

3D Thursday: Generation-jumping 2.5D Xilinx Virtex-7 2000T FPGA delivers 1,954,560 logic cells using 6.8 BILLION transistors (UPDATED!)

Tuesday, Xilinx announced that it is shipping Virtex-7 2000T FPGAs to customers. This is one monster FPGA. Its 6.8 billion transistors deliver 1,954,560 logic cells, 21.55 Mbits of distributed SRAM, 2160 DSP slices, 46,512Kbits of block RAM, four PCIe ports, … Continue reading

Posted in 28nm, 3D, 65nm, EDA360, Silicon Realization, SoC, SoC Realization, System Realization | Tagged , , , , , , | Leave a comment

Generation-jumping 2.5D Xilinx Virtex-7 2000T FPGA delivers 1,954,560 logic cells using 6.8 BILLION transistors (PREVIEW!)

Xilinx announced today that it is shipping Virtex-7 2000T FPGAs to customers. This is one monster FPGA. Its 6.8 billion transistors deliver 1,954,560 logic cells, 21.55 Mbits of distributed SRAM, 2160 DSP slices, 46,512Kbits of block RAM, four PCIe ports, … Continue reading

Posted in 28nm, 3D, 65nm, EDA360, Silicon Realization, SoC, SoC Realization, System Realization, TSV | Tagged , , , , , | Leave a comment

3D Thursday: IMEC prototypes 3D chip stack, finds some thermal surprises

Imec and several of its 3D integration partners (Globalfoundries, Intel, Micron, Panasonic, Samsung, TSMC, Fujitsu, Sony, Amkor, and Qualcomm) have fabricated a 3-chip 3D IC stack demonstration prototype with the intent of proving several assembly methods plus electrical characteristics and … Continue reading

Posted in 3D, Silicon Realization, SoC Realization, System Realization, TSMC, TSV | Tagged , , , , , , , , , , | 1 Comment