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Recent Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Friday Video: SoC in tiny 500mg backpack transforms cockroach into radio-controlled exploration vehicle
- Friday Video: A different kind of fab with some very, very cool machines
- Friday Video: Get the latest skinny on the IPC-2581 open interchange standard for PCB design
- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
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Top Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Ingenious architectural features allow ST to extract maximum performance from new microcontroller family based on ARM Cortex-M4. Cost: less than 6 bucks in 1000s
- ARM Cortex-A15—does this processor IP core need a new category…Superstar IP?
- Are FinFETs inevitable at 20nm? “Yes, no, maybe” says Professor Chenming Hu
- Collaboration is key to making DFM work at 28nm and below
- EDA360 and the brand new Hewlett-Packard 15C Limited Edition RPN pocket scientific calculator
- 3-processor SoC for digital still cameras incorporates an ARM 1136J-S RISC processor core plus separate image and video processors
- The WORD on ARM’s big.LITTLE Cortex-A15/A7 design philosophy from Jack Ganssle, a leading expert and consultant on embedded design and firmware development
- Download a free PDF of the Mixed-signal Methodology Guide, Chapter 1: Design Trends and Challenges
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Tag Archives: Atrenta
3D Thursday: Some unexpected implications of IP subsystems coupled with 3D IC assembly
A new “Experts at the Table” conversation on the Semiconductor Manufacturing and Design Community (SMD) site about IP Subsystems among Kevin Meyer, vice president of design enablement strategy and alliances at GlobalFoundries; Steve Roddy, vice president of marketing at Tensilica; … Continue reading
Posted in 3D, EDA360
Tagged 3D IC, Atrenta, GlobalFoundries, IP Subsystems, Tensilica
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FREE DAC 2012 Exhibit 3-day passes. Limited quantity. Time-limited offer. Get ‘em NOW!
Want to go see the latest EDA offerings on the DAC exhibit floor but you (or your boss) can’t spring for the cash? Bummer. Atrenta, Cadence, and Springsoft feel your pain and once more, the three amigos have partnered to … Continue reading
Friday Video: Atrenta joins the Cadence System Realization Alliance. Customers win
Atrenta announced this week just before ARM TechCon 2011 that it has joined the Cadence System Realization Alliance. The first result of this agreement is to ensure seamless operation of the Atrenta Spyglass platform with the Cadence C-to-Silicon Compiler. Atrenta … Continue reading
