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Recent Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Friday Video: SoC in tiny 500mg backpack transforms cockroach into radio-controlled exploration vehicle
- Friday Video: A different kind of fab with some very, very cool machines
- Friday Video: Get the latest skinny on the IPC-2581 open interchange standard for PCB design
- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
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Top Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- 10 ways to get your EDA tools to run faster, smoother, and longer
- Ingenious architectural features allow ST to extract maximum performance from new microcontroller family based on ARM Cortex-M4. Cost: less than 6 bucks in 1000s
- How many people does it take to design an SoC? – Redux. Building brains with processors.
- Are FinFETs inevitable at 20nm? “Yes, no, maybe” says Professor Chenming Hu (Part 2)
- Friday Video (Musical Bonus): What does it take to play the Dr. Who theme song with a pair of Tesla coils, a Faraday cage, and two unlucky audience members?
- Qualcomm reveals more Snapdragon 4 SoC details in a White Paper. Want to know what’s inside?
- The WORD on ARM’s big.LITTLE Cortex-A15/A7 design philosophy from Jack Ganssle, a leading expert and consultant on embedded design and firmware development
- 3D Thursday: Cypress subsidiary Deca Technologies is onto making silicon interposers for 2.5D packaging in a big way. What if 2.5D got really cheap?
- Between ASIC and microcontroller: It’s all about System Realization
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Tag Archives: Atrenta
3D Thursday: Some unexpected implications of IP subsystems coupled with 3D IC assembly
A new “Experts at the Table” conversation on the Semiconductor Manufacturing and Design Community (SMD) site about IP Subsystems among Kevin Meyer, vice president of design enablement strategy and alliances at GlobalFoundries; Steve Roddy, vice president of marketing at Tensilica; … Continue reading
Posted in 3D, EDA360
Tagged 3D IC, Atrenta, GlobalFoundries, IP Subsystems, Tensilica
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FREE DAC 2012 Exhibit 3-day passes. Limited quantity. Time-limited offer. Get ‘em NOW!
Want to go see the latest EDA offerings on the DAC exhibit floor but you (or your boss) can’t spring for the cash? Bummer. Atrenta, Cadence, and Springsoft feel your pain and once more, the three amigos have partnered to … Continue reading
Friday Video: Atrenta joins the Cadence System Realization Alliance. Customers win
Atrenta announced this week just before ARM TechCon 2011 that it has joined the Cadence System Realization Alliance. The first result of this agreement is to ensure seamless operation of the Atrenta Spyglass platform with the Cadence C-to-Silicon Compiler. Atrenta … Continue reading
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