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Recent Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Friday Video: SoC in tiny 500mg backpack transforms cockroach into radio-controlled exploration vehicle
- Friday Video: A different kind of fab with some very, very cool machines
- Friday Video: Get the latest skinny on the IPC-2581 open interchange standard for PCB design
- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
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Top Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Where is the mainstream IC process technology today? 28nm? 40nm? 65nm?
- EDA360 and the brand new Hewlett-Packard 15C Limited Edition RPN pocket scientific calculator
- Ingenious architectural features allow ST to extract maximum performance from new microcontroller family based on ARM Cortex-M4. Cost: less than 6 bucks in 1000s
- 3-processor SoC for digital still cameras incorporates an ARM 1136J-S RISC processor core plus separate image and video processors
- EMA Design Automation announces FootprintGen—an app for Cadence Allegro and OrCAD PCB design tools that cuts the time needed to design PCB footprint models for new components
- 3D Thursday: 28nm design and 2.5D packaging saves Xilinx a ton of power. You can too even if you're not designing FPGAs!
- Clock Concurrent Optimization: The Primer to the Primer—OR—Want to overcome some major functional hurdles to Silicon Realization and save a lot of power on your SoC at the same time?
- 39 low-cost boards for embedded Linux application development starting with Raspberry Pi. Want the list?
- Friday Video: Want the basics of PCB design in 45 minutes? Dave Jones delivers yet again with a free tutorial.
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Tag Archives: Brian Bailey
3D Thursday: Will water cooling for 3D IC assemblies ever be practical?
Last week, Brian Bailey published an interview with Professor Madhavan Swaminathan who is the Director of the Interconnect and Packaging Center (IPC) at Georgia Tech in Atlanta. The topic of the interview was cooling of 3D IC devices. It’s no … Continue reading
Posted in 2.5D, 3D, EDA360, Silicon Realization, SoC, SoC Realization, System Realization
Tagged 2.5D, 3D, Aquasar, Brian Bailey, FLOPS, IBM, Integrated circuit, SuperMUC, Water cooling
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Power is everything in design today. Believe it?
Brian Bailey has just published an article on low-power design in the EE Life section of EETimes. (See “Power 101 – Power consumption”) Here is Bailey’s premise: “Power, in my opinion, has become a game changer, not just for hardware … Continue reading
Posted in Low Power, Silicon Realization, SoC, SoC Realization, System Realization
Tagged Brian Bailey, EE Times, Jan Rabaey, Low Power
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Brian Bailey asks if hardware/software co-design is a myth or reality, then answers the question
Brian Bailey is a well-known consultant in the EDA industry and he’s just published a short but pithy blog on EETimes examining the state of the art in hardware/software co-design. Bailey does something I really admire in this blog. He … Continue reading
Posted in EDA360, Firmware, System Realization
Tagged Brian Bailey, co-design, codesign, hardware/software co-design
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