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Recent Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Friday Video: SoC in tiny 500mg backpack transforms cockroach into radio-controlled exploration vehicle
- Friday Video: A different kind of fab with some very, very cool machines
- Friday Video: Get the latest skinny on the IPC-2581 open interchange standard for PCB design
- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
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Top Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- 10 ways to get your EDA tools to run faster, smoother, and longer
- Ingenious architectural features allow ST to extract maximum performance from new microcontroller family based on ARM Cortex-M4. Cost: less than 6 bucks in 1000s
- How many people does it take to design an SoC? – Redux. Building brains with processors.
- Are FinFETs inevitable at 20nm? “Yes, no, maybe” says Professor Chenming Hu (Part 2)
- Friday Video (Musical Bonus): What does it take to play the Dr. Who theme song with a pair of Tesla coils, a Faraday cage, and two unlucky audience members?
- Qualcomm reveals more Snapdragon 4 SoC details in a White Paper. Want to know what’s inside?
- The WORD on ARM’s big.LITTLE Cortex-A15/A7 design philosophy from Jack Ganssle, a leading expert and consultant on embedded design and firmware development
- 3D Thursday: Cypress subsidiary Deca Technologies is onto making silicon interposers for 2.5D packaging in a big way. What if 2.5D got really cheap?
- Between ASIC and microcontroller: It’s all about System Realization
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Tag Archives: Brian Bailey
3D Thursday: Will water cooling for 3D IC assemblies ever be practical?
Last week, Brian Bailey published an interview with Professor Madhavan Swaminathan who is the Director of the Interconnect and Packaging Center (IPC) at Georgia Tech in Atlanta. The topic of the interview was cooling of 3D IC devices. It’s no … Continue reading
Posted in 2.5D, 3D, EDA360, Silicon Realization, SoC, SoC Realization, System Realization
Tagged 2.5D, 3D, Aquasar, Brian Bailey, FLOPS, IBM, Integrated circuit, SuperMUC, Water cooling
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Power is everything in design today. Believe it?
Brian Bailey has just published an article on low-power design in the EE Life section of EETimes. (See “Power 101 – Power consumption”) Here is Bailey’s premise: “Power, in my opinion, has become a game changer, not just for hardware … Continue reading
Posted in Low Power, Silicon Realization, SoC, SoC Realization, System Realization
Tagged Brian Bailey, EE Times, Jan Rabaey, Low Power
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Brian Bailey asks if hardware/software co-design is a myth or reality, then answers the question
Brian Bailey is a well-known consultant in the EDA industry and he’s just published a short but pithy blog on EETimes examining the state of the art in hardware/software co-design. Bailey does something I really admire in this blog. He … Continue reading
Posted in EDA360, Firmware, System Realization
Tagged Brian Bailey, co-design, codesign, hardware/software co-design
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