Tag Archives: Cisco

GSA Silicon Summit to highlight cutting-edge IC technologies: 3D IC assembly, FinFETs, and SOI. April 26, Silicon Valley

The Global Semiconductor Alliance (GSA) is sponsoring a half-day event that will drill down into three of the leading-edge IC manufacturing technologies of the coming decade: 3D (and 2.5D) IC assembly, FinFETs (or Tri-gate FETs), and silicon-on-insulator (SOI) substrates. The … Continue reading

Posted in 2.5D, 20nm, 28nm, 32nm, 3D, EDA360, FDSOI, Silicon Realization, SoC, SoC Realization | Tagged , , , , , , | 1 Comment

How would you like some of Cisco’s SoC implementation secrets? Get them at this ARM TechCon session

You know that doing a hasty or inadequate job at the SoC architectural level will cost you in the implementation schedule. If only you could get a few good tips on how to beef up that architectural design-space exploration. Well, … Continue reading

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LSI Corp to host IC innovation conference and technology showcase in Milpitas next week

On October 5 through 7, LSI Corp will be hosting an IC conference and technology showcase in at the beautiful Crowne Plaza Hotel in suburban Milpitas, just north of San Jose (www.lsi.com/AI-conference). Allow me to especially point you to two … Continue reading

Posted in EDA360, Silicon Realization, SoC Realization, System Realization | Tagged , , , , , | Leave a comment