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Tag Archives: Common Platform
Beyond breakfast: An ethical bribe for attending “The Path to Yielding at 2(x)nm and Beyond” at DAC
Yesterday, I wrote about a terrific discussion panel about the challenges of 20nm design at DAC. I am moderating the panel and there will be speakers from the Common Platform partners including IBM, Samsung, GLOBALFOUNDRIES (just confirmed!), and Cadence. (See … Continue reading
Posted in 20nm, DAC, EDA360, Silicon Realization
Tagged 20nm, Cadence, Common Platform, GlobalFoundries, IBM, Samsung
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At DAC: The path to 20nm includes breakfast on Wednesday, June 6
Want to know how to get to 20nm? Want to know why? Want breakfast at DAC on June 6? This is indeed your lucky day because you can get it all done at a special DAC breakfast panel titled “The … Continue reading
Common Platform: Why do these companies (IBM, Samsung, GLOBALFOUNDRIES) collaborate?
Ana Hunter, Foundry Services VP at Samsung Semiconductor, had the honor of kicking off the Global Technology Forum in Silicon Valley. She decided to devote her short intro speech to answering the basic question about the Common Platform—a partnership among … Continue reading
Posted in EDA360, Globalfoundries, Samsung, Silicon Realization
Tagged Common Platform, Global Technology Forum, GlobalFoundries, IBM, Samsung
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Friday Video: Common Platform Technology Forum reveals program agenda, rolls into Silicon Valley on March 14
The Common Platform partners are IBM, Samsung, and GLOBALFOUNDRIES and their annual Technology Forum rolls into Silicon Valley on March 14, so you have a couple of weeks to sign up. This short video from ChipEstimate.com gives you a good … Continue reading
Posted in 14nm, 20nm, 28nm
Tagged 14nm, 20nm, 28nm, Common Platform, GlobalFoundries, IBM, Samsung
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