Tag Archives: DDR SDRAM

3D Thursday: Qualcomm’s Nick Yu says “3D DRAM stacking has started—it’s shipping in products”

Today’s GSA Silicon Summit held at the Computer History Museum in Mountain View, California included a talk on 3D IC assembly by Nick Yu, VP of Engineering, VLSI Engineering, at Qualcomm. Yu is in charge of Qualcomm’s technology roadmaps including … Continue reading

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