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- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Friday Video: SoC in tiny 500mg backpack transforms cockroach into radio-controlled exploration vehicle
- Friday Video: A different kind of fab with some very, very cool machines
- Friday Video: Get the latest skinny on the IPC-2581 open interchange standard for PCB design
- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
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Top Posts
- Ingenious architectural features allow ST to extract maximum performance from new microcontroller family based on ARM Cortex-M4. Cost: less than 6 bucks in 1000s
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- 3D Thursday: How Xilinx developed a 2.5D strategy for making the world’s largest FPGA and what the company might do next with the technology
- Realizing the ARM Cortex-A15: What does the road to 2.5GHz look like?
- Free Webinar teaches you how to mix C, C++, SystemC, and SystemVerilog verification models within UVM—October 20
- Download a free PDF of the Mixed-signal Methodology Guide, Chapter 1: Design Trends and Challenges
- Friday Video: Circuit simulation app for Android. SPICE for $10, runs in your hand? Well, almost.
- 3D Thursday: Micron to present Hybrid Memory Cube status at EDPS in Monterey, April 6—there’s a lot of news
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Tag Archives: DDR2
How can you be sure DDR2, DDR3, and DDR4 SDRAMs will work properly in your system?
LeCroy introduced an upgrade to its Kibra 380 DDR3 SDRAM protocol analyzer today. The analyzer’s probes plug in series with the DDR3 SDRAM modules and the analyzer can identify more than 65 JEDEC command protocol and timing violations in real … Continue reading
Posted in EDA360, Silicon Realization, SoC Realization, System Realization, Verification
Tagged DDR2, DDR3, DDR4, IDF, Intel Developer Forum
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Want to know more about the Micron Hybrid Memory Cube (HMC)? How about its terabit/sec data rate?
Last week, I quoted Ann Steffora Mutschler’s article about the information that Micron has revealed about it’s 3D Hybrid Memory Cube. Now that I’ve got the paper Micron presented at last week’s Hot Chips 23 conference, I’d like to explain … Continue reading
