Search EDA360 Insider
Hey!!! Subscribe now to the EDA360 Insider!
-
Recent Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Friday Video: SoC in tiny 500mg backpack transforms cockroach into radio-controlled exploration vehicle
- Friday Video: A different kind of fab with some very, very cool machines
- Friday Video: Get the latest skinny on the IPC-2581 open interchange standard for PCB design
- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
EDA360 Tag Cloud
- 2.5D
- 3D
- 3D IC
- 20nm
- 28nm
- 32nm
- 40nm
- Agilent
- Altera
- AMD
- Analog
- Android
- Apple
- ARM
- ARM architecture
- ARM Cortex-A15
- ASIC
- Broadcom
- Cadence
- Canon
- Cortex
- Cortex-A15
- Cortex-M0
- DAC
- Dave Jones
- DDR3
- DDR4
- Double Patterning
- EDA
- EDPS
- Field-programmable gate array
- FinFET
- Flash
- Flash memory
- FPGA
- Freescale
- Freescale Semiconductor
- GlobalFoundries
- IBM
- Intel
- IP
- iPad
- iPhone
- JEDEC
- Jim Hogan
- Kinect
- Linux
- Low Power
- Lytro
- microcontroller
- Micron
- Microsoft
- Mixed Signal
- Multi-core processor
- Nvidia
- OrCAD
- pcb
- Printed circuit board
- Qualcomm
- Robot
- Samsung
- SDRAM
- Snapdragon
- SoC
- STMicroelectronics
- SystemC
- Texas Instruments
- TI
- TSMC
- USB
- verification
- video
- Wide I/O
- Xilinx
Top Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Download a free PDF of the Mixed-signal Methodology Guide, Chapter 1: Design Trends and Challenges
- Welcome to 3D Week: Why is 3D important? Now? The memory wall, heat, and disposable sensors
- Intel says Moore’s Law alive and well and living at 32nm
- How do virtual prototyping, emulation, and FPGA prototyping differ? Answers from Frank Schirrmeister
- Friday Video: Want the basics of PCB design in 45 minutes? Dave Jones delivers yet again with a free tutorial.
- Why doesn’t your pc board work?
- Workshop on Analog and Mixed-Signal Design Automation: November 8 in Silicon Valley
Download the EDA360 Vision Paper here:
Tag Archives: Design Compiler
Gary Smith proposes a 3-layer taxonomy for platform-based SoC design—Live from DAC 2012
EDA’s chief analyst Gary Smith is high on IP subsystems—big ones. Only Gary calls them platforms. Why is Smith so enthusiastic? Because, as he says, he was wrong last year in his estimates of how much it costs to develop … Continue reading
Posted in DAC, IP, SoC, SoC Realization, System Realization, Texas instruments
Tagged ARM, Armada, Design Compiler, Marvell, Nvidia, OMAP, Qualcomm, Snapdragon, Tegra
Leave a comment