Tag Archives: EETimes

3D Thursday: More words on the Intel FinFETs (this time from Ron Wilson at EETimes)

Last month, I wrote a couple of articles on FinFETs, those 3D structures coming to some 20nm chips soon to be near you—like in your PC. See “Are FinFETs inevitable at 20nm? “Yes, no, maybe” says Professor Chenming Hu (Part … Continue reading

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