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- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Friday Video: SoC in tiny 500mg backpack transforms cockroach into radio-controlled exploration vehicle
- Friday Video: A different kind of fab with some very, very cool machines
- Friday Video: Get the latest skinny on the IPC-2581 open interchange standard for PCB design
- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
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Top Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Download a free PDF of the Mixed-signal Methodology Guide, Chapter 1: Design Trends and Challenges
- ARM Cortex-A15—does this processor IP core need a new category…Superstar IP?
- Is the Common Platform Alliance a credible competitor to TSMC?
- ARM drops Cortex-A7 core on unsuspecting market, devastates low-power SoC and application-processor landscapes. What’s it all mean?
- If Aladdin’s Genie lived in a Computer-on-Module, it might look like the Gumstix Overo
- Intel’s Knut Grimsrud explains how to get another 20x improvement in SSD performance
- What would you do with a 23,000-simultaneous-thread school of piranha?...asks NVIDIA
- Ingenious architectural features allow ST to extract maximum performance from new microcontroller family based on ARM Cortex-M4. Cost: less than 6 bucks in 1000s
- Experimental , ultra-low-power 1.2V, 65nm SoC from ST and MIT operates at 82.5MHz (!) maximum, 540KHz at 0.54V
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Tag Archives: EUV
What are the challenges of EUV lithography and the issues surrounding double patterning? CDNLive! presentation provides details.
Richard Goering has just published an excellent blog post on double patterning for 20nm and 14nm process geometries in his blog Industry Insights. The post is based on a paper presented by IBM Distinguished Engineer Lars Liebman at the recent … Continue reading
Posted in 14nm, 20nm, Double Patterning, EDA360, EUV, Silicon Realization
Tagged 20nm 14nm, Double Patterning, EUV, Extreme ultraviolet lithography, IBM, Lithography, Microprocessor Report
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GLOBALFOUNDRIES talks FinFETs, EUV, 14nm, ETSOI. Any other bleeding-edge chipmaking terms you wanted to hear?
Near the end of his Global Technology Conference presentation last week, Senior VP of Technology and R&D Gregg Bartlett jumped to the future—namely 2014 to 2015. By then, GLOBALFOUNDRIES plans to be implementing the second production phase for its 20nm … Continue reading
Posted in EDA360, Globalfoundries, Silicon Realization
Tagged 14nm, 20nm, ETSOI, EUV, FinFET
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