Tag Archives: EUV

What are the challenges of EUV lithography and the issues surrounding double patterning? CDNLive! presentation provides details.

Richard Goering has just published an excellent blog post on double patterning for 20nm and 14nm process geometries in his blog Industry Insights. The post is based on a paper presented by IBM Distinguished Engineer Lars Liebman at the recent … Continue reading

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GLOBALFOUNDRIES talks FinFETs, EUV, 14nm, ETSOI. Any other bleeding-edge chipmaking terms you wanted to hear?

Near the end of his Global Technology Conference presentation last week, Senior VP of Technology and R&D Gregg Bartlett jumped to the future—namely 2014 to 2015. By then, GLOBALFOUNDRIES plans to be implementing the second production phase for its 20nm … Continue reading

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