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- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Friday Video: SoC in tiny 500mg backpack transforms cockroach into radio-controlled exploration vehicle
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- Friday Video: Get the latest skinny on the IPC-2581 open interchange standard for PCB design
- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
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Top Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Want to know more about the Micron Hybrid Memory Cube (HMC)? How about its terabit/sec data rate?
- Download a free PDF of the Mixed-signal Methodology Guide, Chapter 1: Design Trends and Challenges
- EDA360 and the brand new Hewlett-Packard 15C Limited Edition RPN pocket scientific calculator
- How DAC Got Started: Richard Goering interviews Kaufman Award Winner Pat Pistilli
- Ingenious architectural features allow ST to extract maximum performance from new microcontroller family based on ARM Cortex-M4. Cost: less than 6 bucks in 1000s
- Apps define storage task, create application-specific SSD
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Tag Archives: Extreme ultraviolet
Friday Video: Luigi Capodieci, a fellow at GLOBALFOUNDRIES, talks 20nm and below, EUV, FINFETs, and the state of the foundry business
Be sure to watch this excellent 13-minute interview done by Mark LePedus starring Luigi Capodieci, a fellow with GLOBALFOUNDRIES, to get a close-up-and-personal look at the state of the foundry business (it’s not dying), 20nm design, EUV in the wings, … Continue reading
Posted in 14nm, 20nm, EUV, Globalfoundries, Silicon Realization
Tagged Extreme ultraviolet, FinFET, GlobalFoundries
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3D Thursday: My breakfast with IBM’s Gary Patton leads to a discussion of 20nm and 14nm IC design
Yesterday I moderated a panel on 2(x)nm success at DAC and one of the panelists was Dr. Gary Patton, VP of IBM’s Semiconductor Research and Development Center in East Fishkill, NY. I’ve heard Dr. Patton speak before and he knows … Continue reading
Posted in 14nm, 20nm, 28nm, Double Patterning, EDA360, EUV, Silicon Realization, SoC, SoC Realization
Tagged Bipolar, CMOS, Extreme ultraviolet, FinFET, Gary Patton, IBM, Multiple patterning, TriGate
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