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Recent Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Friday Video: SoC in tiny 500mg backpack transforms cockroach into radio-controlled exploration vehicle
- Friday Video: A different kind of fab with some very, very cool machines
- Friday Video: Get the latest skinny on the IPC-2581 open interchange standard for PCB design
- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
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Top Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- AppliedMicro demos FPGA emulation of multicore server chip based on new 64-bit ARMv8 architecture
- Ingenious architectural features allow ST to extract maximum performance from new microcontroller family based on ARM Cortex-M4. Cost: less than 6 bucks in 1000s
- Realizing the ARM Cortex-A15: What does the road to 2.5GHz look like?
- Qualcomm reveals more Snapdragon 4 SoC details in a White Paper. Want to know what’s inside?
- Who wants more technical detail on the Altera SoC FPGA? Altera says…you!
- More news on the asymmetric processing SoC front
- Friday Video: Xtreme Embedded Design—A fully operational, 1/6-scale Atari Star Wars Arcade machine
- Want to know more about the Micron Hybrid Memory Cube (HMC)? How about its terabit/sec data rate?
- The DDR4 SDRAM spec and SoC design. What do we know now?
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Tag Archives: Fujitsu
Fujitsu adopts Cadence Chip Planning System for worldwide microcontroller design. Why? “It helps us build better chips faster.” Want one?
Fujitsu is one of the world’s top 10 microcontroller vendors. To stay competitive in this crowded, $15 billion market (2011 estimate by Databeans), a microcontroller vendor must freshen its microcontroller offerings at a very rapid pace and any boost in … Continue reading
3D Thursday: Lessons learned from the IMEC’s 3D DRAM-on-logic chip design work
I recently covered the groundbreaking WIOMING 3D chip design done by CEA-Imec in conjunction with ST-Ericsson. (See “3D Week: Wide I/O SDRAM, Network on Chip, Multicore, TSV, Asynchronous Logic—3D SoC stack from CEA-Leti and ST-Ericsson hits all the advanced notes. … Continue reading
Need an ARM-based 32-bit microcontroller? There’s more than a few full houses on offer.
When 17 microcontroller vendors pick your processor architecture, you have a right to sing “Something’s happening here.” Alban Rampon of ARM just published a blog entry titled “ARM Cortex-M—How could you choose your microcontroller?” This blog entry lists 17 semiconductor … Continue reading
3D Thursday: IMEC prototypes 3D chip stack, finds some thermal surprises
Imec and several of its 3D integration partners (Globalfoundries, Intel, Micron, Panasonic, Samsung, TSMC, Fujitsu, Sony, Amkor, and Qualcomm) have fabricated a 3-chip 3D IC stack demonstration prototype with the intent of proving several assembly methods plus electrical characteristics and … Continue reading
Posted in 3D, Silicon Realization, SoC Realization, System Realization, TSMC, TSV
Tagged Amkor, Fujitsu, GlobalFoundries, Imec, Intel, Micron, Panasonic, Qualcomm, Samsung, Sony, TSMC
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