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Recent Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Friday Video: SoC in tiny 500mg backpack transforms cockroach into radio-controlled exploration vehicle
- Friday Video: A different kind of fab with some very, very cool machines
- Friday Video: Get the latest skinny on the IPC-2581 open interchange standard for PCB design
- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
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2.5D 3D 3D IC 20nm 28nm 32nm 40nm Agilent Altera AMD Analog Android Apple ARM ARM architecture ARM Cortex-A15 ASIC Broadcom Cadence Canon Cortex Cortex-A15 Cortex-M0 DAC Dave Jones DDR3 DDR4 Double Patterning EDA EDPS Field-programmable gate array FinFET Flash Flash memory FPGA Freescale Freescale Semiconductor GlobalFoundries Google IBM Intel IP iPad iPhone JEDEC Jim Hogan Kinect Linux Low Power Lytro microcontroller Micron Microsoft Mixed Signal Multi-core processor Nvidia OrCAD pcb Printed circuit board Qualcomm Robot Samsung SDRAM Snapdragon SoC STMicroelectronics SystemC Texas Instruments TI TSMC USB verification video Wide I/O XilinxTop Posts
- The DDR4 SDRAM spec and SoC design. What do we know now?
- 3D Thursday: Intel and FinFETs (Tri-Gate transistors)—a different kind of 3D
- What can you do with 45nm SOI? A lot, it turns out
- GLOBALFOUNDRIES’ 28nm process comes in three flavors. Which is right for you?
- The WORD on ARM’s big.LITTLE Cortex-A15/A7 design philosophy from Jack Ganssle, a leading expert and consultant on embedded design and firmware development
- How do virtual prototyping, emulation, and FPGA prototyping differ? Answers from Frank Schirrmeister
- There’s a solar eclipse coming. Here’s a test shot from a Canon 60D dSLR, a Spiratone 400mm Sharpshooter, and a 2x telextender.
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- 3D Thursday: The “King of 3D ICs” (Herb Reiter) speaks to his subjects—“Learn to work together”
- Can 2.5D IC assembly really reduce SoC software-development costs? Gabe Moretti thinks it can
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Tag Archives: Georgia Institute of Technology
3D Thursday: Three on 3D—papers from ISSCC
San Francisco Tech writer Rik Myslewski just published a long article on the UK’s “The Register” Web site covering three 3D papers given at last week’s ISSCC. The papers were presented by IBM (“3D system prototype of an eDRAM cache … Continue reading
