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- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Friday Video: SoC in tiny 500mg backpack transforms cockroach into radio-controlled exploration vehicle
- Friday Video: A different kind of fab with some very, very cool machines
- Friday Video: Get the latest skinny on the IPC-2581 open interchange standard for PCB design
- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
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- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- LeCroy’s “Basic” Edition Advisor T3 USB 3.0 Protocol Analyzer costs $2995
- 3D Thursday: Intel Penwell SoC for mobile phones employs POP (package-on-package) LPDDR2 SDRAM to reduce power
- EDA360 and the brand new Hewlett-Packard 15C Limited Edition RPN pocket scientific calculator
- 39 low-cost boards for embedded Linux application development starting with Raspberry Pi. Want the list?
- 3D Week: Wide I/O SDRAM, Network on Chip, Multicore, TSV, Asynchronous Logic—3D SoC stack from CEA-Leti and ST-Ericsson hits all the advanced notes. Can you say “Tour de Force”?
- Scoreboarding “app” for Formal verification tools allows anyone to get exhaustive verification results—even on datapaths
- Are FinFETs inevitable at 20nm? “Yes, no, maybe” says Professor Chenming Hu
- Moore’s Law: Wanted, Dead or Alive
- Download a free PDF of the Mixed-signal Methodology Guide, Chapter 1: Design Trends and Challenges
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Tag Archives: Georgia Institute of Technology
3D Thursday: Three on 3D—papers from ISSCC
San Francisco Tech writer Rik Myslewski just published a long article on the UK’s “The Register” Web site covering three 3D papers given at last week’s ISSCC. The papers were presented by IBM (“3D system prototype of an eDRAM cache … Continue reading
