Tag Archives: GSA

3D Thursday: Where can you start with 3D?

Posted on November 10, 2011 by sleibson2

My first panelist to speak on last week’s 3D IC panel at the 9th International SoC Conference in Newport Beach was Herb Reiter, generally known as “Mr. 3D.” Herb knows everyone in the industry connected to anything 3D. He’s been … Continue reading →

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3D Thursday: 3D-IC Design Tools and Services Tour Guide is just in time for DAC. You can download a copy now.

Posted on May 26, 2011 by sleibson2

The GSA has just issued a 3D-IC tools and services guide in time for DAC. This 62-page guide provides eight pages of background info on the state of 3D assembly technology based on public information like that provided by Xilinx … Continue reading →

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3D Thursday: GSA working on 3D IC report covering benefits of and barriers to adoption

Posted on April 28, 2011 by sleibson2

Just got an email from the GSA (www.gsaglobal.org) that it is working on a report titled “3D IC Architecture: A Natural Evolution” to be published in the second half of the year. Currently, the document is merely an abstract that … Continue reading →

Posted in 3D, EDA360, Packaging, Silicon Realization, System Realization | Tagged , | 1 Comment

Video: Cadence CMO John Bruggeman speaks about EDA360 and the Three Realizations (System, SoC, and Silicon)

Posted on October 12, 2010 by sleibson2

Last month at the GSA Emerging Opportunities Expo and Conference held in Santa Clara, Cadence CMO John Bruggeman found himself on a panel (From MIDs to Base Stations – Where Mobility Infrastructure Meets Innovation) with representatives from four hardware and … Continue reading →

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