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- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Friday Video: SoC in tiny 500mg backpack transforms cockroach into radio-controlled exploration vehicle
- Friday Video: A different kind of fab with some very, very cool machines
- Friday Video: Get the latest skinny on the IPC-2581 open interchange standard for PCB design
- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
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Top Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Download a free PDF of the Mixed-signal Methodology Guide, Chapter 1: Design Trends and Challenges
- Welcome to 3D Week: Why is 3D important? Now? The memory wall, heat, and disposable sensors
- Want to know more about the Micron Hybrid Memory Cube (HMC)? How about its terabit/sec data rate?
- Intel says Moore’s Law alive and well and living at 32nm
- How do virtual prototyping, emulation, and FPGA prototyping differ? Answers from Frank Schirrmeister
- Friday Video: Want the basics of PCB design in 45 minutes? Dave Jones delivers yet again with a free tutorial.
- Why doesn’t your pc board work?
- Workshop on Analog and Mixed-Signal Design Automation: November 8 in Silicon Valley
- How DAC Got Started: Richard Goering interviews Kaufman Award Winner Pat Pistilli
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Tag Archives: Herb Reiter
Friday Video: Mr. 3D IC, Herb Reiter, speaks about his start with 3D, where it is, where it’s going
I conducted this video interview with Herb Reiter, “Mr. 3D IC” and president of eda2asic, the day after he spoke at a MEPTEC lunch in Silicon Valley—see “3D Thursday: The “King of 3D ICs” (Herb Reiter) speaks to his subjects—‘Learn … Continue reading
3D Thursday: The “King of 3D ICs” (Herb Reiter) speaks to his subjects—“Learn to work together”
Mr. 3D IC—aka Herb Reiter—spoke to an attentive group of packaging experts about the state of 3D IC technical and business development today at a MEPTEC luncheon held at the “luxurious” Biltmore Hotel in cental Silicon Valley. I’ve written about … Continue reading
Posted in 2.5D, 3D, DAC, EDA360, Low Power, Packaging, Silicon Realization, SoC, SoC Realization, System Realization, Wide I/O
Tagged 2.5D, 3D, Herb Reiter, IBM, Reiter, Three-dimensional integrated circuit, TSMC, Xilinx
5 Comments
3D Thursday: GSA working on 3D IC report covering benefits of and barriers to adoption
Just got an email from the GSA (www.gsaglobal.org) that it is working on a report titled “3D IC Architecture: A Natural Evolution” to be published in the second half of the year. Currently, the document is merely an abstract that … Continue reading
Posted in 3D, EDA360, Packaging, Silicon Realization, System Realization
Tagged GSA, Herb Reiter
1 Comment
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