Tag Archives: Herb Reiter

Friday Video: Mr. 3D IC, Herb Reiter, speaks about his start with 3D, where it is, where it’s going

I conducted this video interview with Herb Reiter, “Mr. 3D IC” and president of eda2asic, the day after he spoke at a MEPTEC lunch in Silicon Valley—see “3D Thursday: The “King of 3D ICs” (Herb Reiter) speaks to his subjects—‘Learn … Continue reading

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3D Thursday: The “King of 3D ICs” (Herb Reiter) speaks to his subjects—“Learn to work together”

Mr. 3D IC—aka Herb Reiter—spoke to an attentive group of packaging experts about the state of 3D IC technical and business development today at a MEPTEC luncheon held at the “luxurious” Biltmore Hotel in cental Silicon Valley. I’ve written about … Continue reading

Posted in 2.5D, 3D, DAC, EDA360, Low Power, Packaging, Silicon Realization, SoC, SoC Realization, System Realization, Wide I/O | Tagged , , , , , , , | 5 Comments

3D Thursday: GSA working on 3D IC report covering benefits of and barriers to adoption

Just got an email from the GSA (www.gsaglobal.org) that it is working on a report titled “3D IC Architecture: A Natural Evolution” to be published in the second half of the year. Currently, the document is merely an abstract that … Continue reading

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