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- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Friday Video: SoC in tiny 500mg backpack transforms cockroach into radio-controlled exploration vehicle
- Friday Video: A different kind of fab with some very, very cool machines
- Friday Video: Get the latest skinny on the IPC-2581 open interchange standard for PCB design
- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
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Top Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- EDA360 and the brand new Hewlett-Packard 15C Limited Edition RPN pocket scientific calculator
- 10 ways to get your EDA tools to run faster, smoother, and longer
- Qualcomm reveals more Snapdragon 4 SoC details in a White Paper. Want to know what’s inside?
- Friday Video: Ready for a little mobile phone teardown archaeology? Dave Jones compares state of the art in 1994 (Motorola) with an evolved 2000 (Nokia)
- 20nm design: What have we learned so far?
- The DDR4 SDRAM spec and SoC design. What do we know now?
- 3D Week: Wide I/O SDRAM, Network on Chip, Multicore, TSV, Asynchronous Logic—3D SoC stack from CEA-Leti and ST-Ericsson hits all the advanced notes. Can you say “Tour de Force”?
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Tag Archives: HKMG
Moore’s Law: Wanted, Dead or Alive
Moore’s Law is not dead but the vital signs have clearly changed. That was the key message I heard from Dr. Subramanian Iyer, Fellow and Chief Technologist at the IBM Systems & Technology Group, during the GSA Silicon Summit held … Continue reading
TSMC simplifies life at 20nm, will offer a single 20nm process technology
TSMC’s Executive Vice President and Co-Chief Operating Officer Dr. Shang-yi Chiang said at yesterday’s TSMC Symposium that the company will offer one process at the 20nm node, as reported by Dylan McGrath of EETimes. This position differs from the two- … Continue reading
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