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Recent Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Friday Video: SoC in tiny 500mg backpack transforms cockroach into radio-controlled exploration vehicle
- Friday Video: A different kind of fab with some very, very cool machines
- Friday Video: Get the latest skinny on the IPC-2581 open interchange standard for PCB design
- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
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- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- 39 low-cost boards for embedded Linux application development starting with Raspberry Pi. Want the list?
- Friday Video: Webcam + Open-source video code + Arduino Uno microcontroller board + pan/tilt servo make automated face-tracker, prove the power of an apps-centric world
- 3D Thursday: Intel Penwell SoC for mobile phones employs POP (package-on-package) LPDDR2 SDRAM to reduce power
- The DDR4 SDRAM spec and SoC design. What do we know now?
- 3-processor SoC for digital still cameras incorporates an ARM 1136J-S RISC processor core plus separate image and video processors
- Freescale starts sampling $0.49 Kinetis L microcontrollers based on ARM Cortex-M0+ processor core
- Want to know more about the Micron Hybrid Memory Cube (HMC)? How about its terabit/sec data rate?
- How about a quick and easy guide to ARM Cortex processor cores? Got one for you from ARM TechCon 2011
- Xilinx Zynq EPPs based on two ARM Cortex-A9s create a new category that fits in among SoCs, FPGAs, and microcontrollers
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Tag Archives: HMC
3D Thursday: Micron to present Hybrid Memory Cube status at EDPS in Monterey, April 6—there’s a lot of news
I’ve already written many blog entries about the Micron Hybrid Memory Cube (HMC), a 3D stacked memory device that can deliver a theoretical DRAM bandwidth of 128Gbytes/sec to a host system using a 4-die stack of DRAM (NOT SDRAM) on … Continue reading
Posted in 3D, EDA360, Silicon Realization, SoC, SoC Realization
Tagged EDPS, HMC, IBM, Micron
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3D Thursday: Let’s end 2011 with a high-performance DRAM memory stack design. How would you improve it?
For the last 3D Thursday blog post of 2011in the EDA360 Insider, I thought I’d take a flight of fancy and try to put as many of this year’s 3D IC concepts as possible together to see what we might … Continue reading
Posted in 2.5D, 3D, EDA360, Memory, SoC, SoC Realization, System Realization
Tagged 2.5D, 3D, HMC, IBM, JEDEC, Micron, Wide I/O
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3D Thursday: Hybrid Memory Cube—wide I/O only more so—gets an industry consortium
Back in August, I wrote about the 3D SDRAM assembly called the Micron Hybrid Memory Cube (HMC, see “Want to know more about the Micron Hybrid Memory Cube (HMC)? How about its terabit/sec data rate?”) and I called it a … Continue reading
Posted in 3D, EDA360, Memory, Samsung, SoC Realization
Tagged Altera, HMC, HMCC, Hybrid Memory Cube, Micron, Open-Silicon, Xilinx
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