Search EDA360 Insider
Hey!!! Subscribe now to the EDA360 Insider!
-
Recent Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Friday Video: SoC in tiny 500mg backpack transforms cockroach into radio-controlled exploration vehicle
- Friday Video: A different kind of fab with some very, very cool machines
- Friday Video: Get the latest skinny on the IPC-2581 open interchange standard for PCB design
- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
EDA360 Tag Cloud
- 2.5D
- 3D
- 3D IC
- 20nm
- 28nm
- 32nm
- 40nm
- Agilent
- Altera
- AMD
- Analog
- Android
- Apple
- ARM
- ARM architecture
- ARM Cortex-A15
- ASIC
- Broadcom
- Cadence
- Canon
- Cortex
- Cortex-A15
- Cortex-M0
- DAC
- Dave Jones
- DDR3
- DDR4
- Double Patterning
- EDA
- EDPS
- Field-programmable gate array
- FinFET
- Flash
- Flash memory
- FPGA
- Freescale
- Freescale Semiconductor
- GlobalFoundries
- IBM
- Intel
- IP
- iPad
- iPhone
- JEDEC
- Jim Hogan
- Kinect
- Linux
- Low Power
- Lytro
- microcontroller
- Micron
- Microsoft
- Mixed Signal
- Multi-core processor
- Nvidia
- OrCAD
- pcb
- Printed circuit board
- Qualcomm
- Robot
- Samsung
- SDRAM
- Snapdragon
- SoC
- STMicroelectronics
- SystemC
- Texas Instruments
- TI
- TSMC
- USB
- verification
- video
- Wide I/O
- Xilinx
Top Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- 3D Thursday: More on the Xilinx Virtex 7 with 2.5D tiling. Wave of the future or stopgap measure?
- 20nm design: What have we learned so far?
- Ingenious architectural features allow ST to extract maximum performance from new microcontroller family based on ARM Cortex-M4. Cost: less than 6 bucks in 1000s
- The WORD on ARM’s big.LITTLE Cortex-A15/A7 design philosophy from Jack Ganssle, a leading expert and consultant on embedded design and firmware development
- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
Download the EDA360 Vision Paper here:
Tag Archives: Hot Chips
Hot Chips 24 in August will feature a 3D tutorial plus details of new chips from AMD, Intel, Xilinx, and more
This year’s Hot Chips conference takes place on August 24-29 in a new venue: The Flint Center for the Performing Arts in Cupertino, CA. On the afternoon of August 27, there’s a die-stacking tutorial with presentations from AMD, Amkor, SK … Continue reading
Posted in EDA360
Tagged Advanced Micro Devices, AMD, Field-programmable gate array, Hot Chips, Intel, Toshiba, Xilinx
Leave a comment
Are you good enough to present at Hot Chips 2012?
There’s one premier venue for presenting the year’s most important IC breakthroughs and that’s Hot Chips. The event takes place at Stanford University in late summer each year and it gives the most advanced IC development teams the chance to … Continue reading
Posted in EDA360, Silicon Realization, SoC, SoC Realization, System Realization
Tagged Hot Chips
Leave a comment
Friday Video: Willow Garage PR2 Robot participates in Hot Chips 23 keynote, demonstrates how tough a design problem autonomous robotics will be
Last week at the Hot Chips 23 conference held at Stanford, Willow Garage President and CEO Steve Cousins gave attendees a 1-hour taste for the difficulties associated with designing autonomous robots that can freely interact with people without hurting them. … Continue reading
Posted in EDA360, System Realization
Tagged HC23, Hot Chips, Kinect, PR2, Robot, robotics, Ubuntu, Willow Garage
Leave a comment
EDA360 Insider 