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Recent Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Friday Video: SoC in tiny 500mg backpack transforms cockroach into radio-controlled exploration vehicle
- Friday Video: A different kind of fab with some very, very cool machines
- Friday Video: Get the latest skinny on the IPC-2581 open interchange standard for PCB design
- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
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Top Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- ARM Cortex-A15—does this processor IP core need a new category…Superstar IP?
- The DDR4 SDRAM spec and SoC design. What do we know now?
- Gartner’s Sam Wang tosses down the 28nm Silicon Realization gauntlet to IC design houses
- Is 28nm really here? Now? When?
- New apps for pcb designers in the OrCad Capture Marketplace speed common design tasks
- 3-processor SoC for digital still cameras incorporates an ARM 1136J-S RISC processor core plus separate image and video processors
- Generation-jumping 2.5D Xilinx Virtex-7 2000T FPGA delivers 1,954,560 logic cells using 6.8 BILLION transistors (PREVIEW!)
- 39 low-cost boards for embedded Linux application development starting with Raspberry Pi. Want the list?
- Between ASIC and microcontroller: It’s all about System Realization
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Tag Archives: Hot Chips
Hot Chips 24 in August will feature a 3D tutorial plus details of new chips from AMD, Intel, Xilinx, and more
This year’s Hot Chips conference takes place on August 24-29 in a new venue: The Flint Center for the Performing Arts in Cupertino, CA. On the afternoon of August 27, there’s a die-stacking tutorial with presentations from AMD, Amkor, SK … Continue reading
Posted in EDA360
Tagged Advanced Micro Devices, AMD, Field-programmable gate array, Hot Chips, Intel, Toshiba, Xilinx
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Are you good enough to present at Hot Chips 2012?
There’s one premier venue for presenting the year’s most important IC breakthroughs and that’s Hot Chips. The event takes place at Stanford University in late summer each year and it gives the most advanced IC development teams the chance to … Continue reading
Posted in EDA360, Silicon Realization, SoC, SoC Realization, System Realization
Tagged Hot Chips
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Friday Video: Willow Garage PR2 Robot participates in Hot Chips 23 keynote, demonstrates how tough a design problem autonomous robotics will be
Last week at the Hot Chips 23 conference held at Stanford, Willow Garage President and CEO Steve Cousins gave attendees a 1-hour taste for the difficulties associated with designing autonomous robots that can freely interact with people without hurting them. … Continue reading
Posted in EDA360, System Realization
Tagged HC23, Hot Chips, Kinect, PR2, Robot, robotics, Ubuntu, Willow Garage
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