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Recent Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Friday Video: SoC in tiny 500mg backpack transforms cockroach into radio-controlled exploration vehicle
- Friday Video: A different kind of fab with some very, very cool machines
- Friday Video: Get the latest skinny on the IPC-2581 open interchange standard for PCB design
- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
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Top Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Ingenious architectural features allow ST to extract maximum performance from new microcontroller family based on ARM Cortex-M4. Cost: less than 6 bucks in 1000s
- The DDR4 SDRAM spec and SoC design. What do we know now?
- About
- Power, Performance, Cost. FDSOI lets you pick any three. Want proof? How about an ARM Cortex-M0 processor core example?
- 3D Thursday: How Xilinx developed a 2.5D strategy for making the world’s largest FPGA and what the company might do next with the technology
- Download a free PDF of the Mixed-signal Methodology Guide, Chapter 1: Design Trends and Challenges
- Realizing the ARM Cortex-A15: What does the road to 2.5GHz look like?
- EETimes video of Xilinx Zync EPP shows that it takes six FPGAs to emulate one EPP
- Globalfoundries, LSI Corp, and Broadcom help Editorial Director Ed Sperling give the industry a low-power report card. How did we score?
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Tag Archives: Hot Chips
Hot Chips 24 in August will feature a 3D tutorial plus details of new chips from AMD, Intel, Xilinx, and more
This year’s Hot Chips conference takes place on August 24-29 in a new venue: The Flint Center for the Performing Arts in Cupertino, CA. On the afternoon of August 27, there’s a die-stacking tutorial with presentations from AMD, Amkor, SK … Continue reading
Posted in EDA360
Tagged Advanced Micro Devices, AMD, Field-programmable gate array, Hot Chips, Intel, Toshiba, Xilinx
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Are you good enough to present at Hot Chips 2012?
There’s one premier venue for presenting the year’s most important IC breakthroughs and that’s Hot Chips. The event takes place at Stanford University in late summer each year and it gives the most advanced IC development teams the chance to … Continue reading
Posted in EDA360, Silicon Realization, SoC, SoC Realization, System Realization
Tagged Hot Chips
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Friday Video: Willow Garage PR2 Robot participates in Hot Chips 23 keynote, demonstrates how tough a design problem autonomous robotics will be
Last week at the Hot Chips 23 conference held at Stanford, Willow Garage President and CEO Steve Cousins gave attendees a 1-hour taste for the difficulties associated with designing autonomous robots that can freely interact with people without hurting them. … Continue reading
Posted in EDA360, System Realization
Tagged HC23, Hot Chips, Kinect, PR2, Robot, robotics, Ubuntu, Willow Garage
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