Tag Archives: Hybrid Memory Cube

3D Thursday: ARM, HP, and SK hynix join Hybrid Memory Cube Consortium (HMCC)

Posted on June 28, 2012 by sleibson2

Add ARM, HP, and SK hynix to the growing list of companies in the Hybrid Memory Cube Consortium (HMCC). The three new members join the original founding companies, Micron and Samsung, along with Altera, IBM, Microsoft, Open-Silicon, and Xilinx plus … Continue reading →

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3D Thursday: Hybrid Memory Cube—Does anyone know what’s happening with IBM and Micron?

Posted on December 1, 2011 by sleibson2

This week, IBM and Micron apparently made a joint announcement (or perhaps just IBM made an announcement) regarding the manufacture of Micron’s Hybrid Memory Cube. There are varying reports and I cannot find the original statements on either company’s Web … Continue reading →

Posted in EDA360, Low Power, Memory, SoC, SoC Realization, System Realization, TSV | Tagged , , , | Leave a comment

3D Thursday (early): Steve’s Improbable History of 3D ICs? Six decades of 3D electronic packaging

Posted on November 9, 2011 by sleibson2

Last week at the 9th International SoC Conference in Newport Beach, I moderated a 3D IC panel that did a great job of exploring today’s state of the art for 3D IC development. I will be blogging the presentations made … Continue reading →

Posted in 28nm, 3D, EDA360, Low Power, Memory, TSV | Tagged , , , , , , , , , , , | 1 Comment

3D Thursday: Hybrid Memory Cube—wide I/O only more so—gets an industry consortium

Posted on October 13, 2011 by sleibson2

Back in August, I wrote about the 3D SDRAM assembly called the Micron Hybrid Memory Cube (HMC, see “Want to know more about the Micron Hybrid Memory Cube (HMC)? How about its terabit/sec data rate?”) and I called it a … Continue reading →

Posted in 3D, EDA360, Memory, Samsung, SoC Realization | Tagged , , , , , , | Leave a comment