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- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Friday Video: SoC in tiny 500mg backpack transforms cockroach into radio-controlled exploration vehicle
- Friday Video: A different kind of fab with some very, very cool machines
- Friday Video: Get the latest skinny on the IPC-2581 open interchange standard for PCB design
- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
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Top Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- 3-processor SoC for digital still cameras incorporates an ARM 1136J-S RISC processor core plus separate image and video processors
- 3D Thursday: Micron’s 3D Hybrid Memory Cube delivers more DRAM bandwidth at lower power and in a smaller form factor using TSVs
- Collaboration is key to making DFM work at 28nm and below
- 3D Thursday: A look at some genuine 3D NAND cells, courtesy of Micron
- Friday Video: How many hardware/software integration lessons can you absorb in 34 minutes?
- The DDR4 SDRAM spec and SoC design. What do we know now?
- Clock Concurrent Optimization: The Primer to the Primer—OR—Want to overcome some major functional hurdles to Silicon Realization and save a lot of power on your SoC at the same time?
- Intel’s Knut Grimsrud explains how to get another 20x improvement in SSD performance
- Where is the mainstream IC process technology today? 28nm? 40nm? 65nm?
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Tag Archives: IC design
DAC 2012: Get answers to all of your EDA questions at 78 Cadence demo suite slots
Next week (Monday, Tuesday, and Wednesday) you can get all of your EDA questions answered at the Cadence DAC demo suites. There are 78 demos over the three days covering the following EDA topics: Mixed-signal and low-power design RTL-to-GDSII design … Continue reading
Posted in DAC, EDA360, Low Power, Mixed Signal, pcb, Silicon Realization, SoC, SoC Realization, System Realization, TLM, Verification, VIP, Virtual Prototyping
Tagged DAC, EDA, IC design, pcb, synthesis, verification
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