Tag Archives: IC packaging

3D Thursday: 3D ICs and analog chips. Where’s the match? Is there a match?

Dr. Venu Menon, VP of Analog Technology Development at TI, gave a deeply informative lunchtime keynote speech at this week’s ISQED Symposium. Most of Menon’s presentation discussed analog process technology: what’s important to analog chip design and manufacturing, what’s changed … Continue reading

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