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Top Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
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- Power, Performance, Cost. FDSOI lets you pick any three. Want proof? How about an ARM Cortex-M0 processor core example?
- 3D Thursday: How Xilinx developed a 2.5D strategy for making the world’s largest FPGA and what the company might do next with the technology
- Download a free PDF of the Mixed-signal Methodology Guide, Chapter 1: Design Trends and Challenges
- EETimes video of Xilinx Zync EPP shows that it takes six FPGAs to emulate one EPP
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Tag Archives: Imec
3D Thursday: Lessons learned from the IMEC’s 3D DRAM-on-logic chip design work
I recently covered the groundbreaking WIOMING 3D chip design done by CEA-Imec in conjunction with ST-Ericsson. (See “3D Week: Wide I/O SDRAM, Network on Chip, Multicore, TSV, Asynchronous Logic—3D SoC stack from CEA-Leti and ST-Ericsson hits all the advanced notes. … Continue reading
3D Thursday: TSMC’s 3D plans and the word on 3D from Xilinx, Nvidia, IMEC, and STATS ChipPAC
For another take on last month’s RTI 3D conference held in Burlingame, CA, see Dr. Phil Garrou’s blog on the ElectroIQ site. Click here. For previous EDA360 Insider coverage of this event, see “3D Week: Wide I/O SDRAM, Network on … Continue reading
Posted in 3D, EDA360, Silicon Realization, SoC Realization, System Realization, TSMC
Tagged Imec, Nvidia, STATS ChipPAC, TSMC, Xilinx
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3D Thursday: Low-cost, all-day workshop on 3D IC to be held in Newport Beach, December 9. Early bird discount ends November 25
This has to be the 3D IC educational bargain for this year. The Orange County Chapter of the IEEE Components, Packaging and Manufacturing Technology (CPMT) Society is sponsoring an all-day workshop on 3D IC technology on December 9, 2011. The … Continue reading
DFT for 3D-IC: It’s déjà vu all over again
Reading Richard Goering’s blog about the Cadence-Imec collaboration on 3D-IC design for test architecture—How Imec and Cadence “Wrapped Up” 3D-IC Test—gave me a strong sense of déjà vu all over again. (Never pass up a chance to quote the great … Continue reading
Posted in 3D, EDA360, Packaging, Silicon Realization
Tagged Cadence, IEEE 1149.1, IEEE 1500, Imec, JTAG
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3D Thursday: IMEC prototypes 3D chip stack, finds some thermal surprises
Imec and several of its 3D integration partners (Globalfoundries, Intel, Micron, Panasonic, Samsung, TSMC, Fujitsu, Sony, Amkor, and Qualcomm) have fabricated a 3-chip 3D IC stack demonstration prototype with the intent of proving several assembly methods plus electrical characteristics and … Continue reading
Posted in 3D, Silicon Realization, SoC Realization, System Realization, TSMC, TSV
Tagged Amkor, Fujitsu, GlobalFoundries, Imec, Intel, Micron, Panasonic, Qualcomm, Samsung, Sony, TSMC
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