Tag Archives: Interposer

3D Thursday: A quick look at glass interposers for 3D IC assembly

3D InCites just published a short piece on glass interposers for 3D ICs, as discussed at the 2012 IMAPS International Device Packaging conference, held March 5-8 in Scottsdale, AZ. If you’re interested in seeing a more technical presentation on the … Continue reading

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