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Recent Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Friday Video: SoC in tiny 500mg backpack transforms cockroach into radio-controlled exploration vehicle
- Friday Video: A different kind of fab with some very, very cool machines
- Friday Video: Get the latest skinny on the IPC-2581 open interchange standard for PCB design
- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
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Top Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- The DDR4 SDRAM spec and SoC design. What do we know now?
- Who wants more technical detail on the Altera SoC FPGA? Altera says…you!
- 3D Thursday (early): Steve’s Improbable History of 3D ICs? Six decades of 3D electronic packaging
- ARM furthers its “cover the earth” strategy with introduction of R5 and R7 core variants for fast, real-time, deterministic SoC applications
- ARM adds ARM Cortex-A15 and Cortex-R5 models to Fast Models 6.1 release, making these cores immediately available to System Realization teams
- 3D Thursday: CEA-Leti launches Open 3D IC assembly partnership program
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Tag Archives: IP Integration
Tales from the EDA CEOs: The EDAC panel talks about IP and SoC integration, power, and other topics
Richard Goering has written up last week’s EDA CEO panel, sponsored by EDAC (the EDA Consortium). The panel took place at the Silicon Valley Bank’s headquarters in Santa Clara, California and featured CEOs from four EDA companies—Cadence (Lip-Bu Tan), Gradient … Continue reading
Posted in 3D, Apps, EDA360, Silicon Realization, SoC, SoC Realization, System Realization
Tagged 3D, Cadence, EDA, IP, IP Integration, Lego, Low Power, Mentor Graphics, Synopsys
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