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Recent Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Friday Video: SoC in tiny 500mg backpack transforms cockroach into radio-controlled exploration vehicle
- Friday Video: A different kind of fab with some very, very cool machines
- Friday Video: Get the latest skinny on the IPC-2581 open interchange standard for PCB design
- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
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Top Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Download a free PDF of the Mixed-signal Methodology Guide, Chapter 1: Design Trends and Challenges
- 3D Week: Wide I/O SDRAM, Network on Chip, Multicore, TSV, Asynchronous Logic—3D SoC stack from CEA-Leti and ST-Ericsson hits all the advanced notes. Can you say “Tour de Force”?
- Ingenious architectural features allow ST to extract maximum performance from new microcontroller family based on ARM Cortex-M4. Cost: less than 6 bucks in 1000s
- Welcome to 3D Week: Why is 3D important? Now? The memory wall, heat, and disposable sensors
- “Professor” Aart de Geus gives latest Techonomics lecture on collaboration and System Realization at the Semico Summit in Scottsdale
- Intel says Moore’s Law alive and well and living at 32nm
- How do virtual prototyping, emulation, and FPGA prototyping differ? Answers from Frank Schirrmeister
- Friday Video: Want the basics of PCB design in 45 minutes? Dave Jones delivers yet again with a free tutorial.
- Why doesn’t your pc board work?
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Tag Archives: Lego
Friday Video: “2001—A Space Odyssey” compressed to 76 seconds and built with Legos
Who would have thought you could build Stanley Kubrick’s spaceship models from the movie “2001” using Lego bricks? Who would have thought you could compress the entire movie to 76 seconds and lose essentially none of the plot? Spite Your … Continue reading
Tales from the EDA CEOs: The EDAC panel talks about IP and SoC integration, power, and other topics
Richard Goering has written up last week’s EDA CEO panel, sponsored by EDAC (the EDA Consortium). The panel took place at the Silicon Valley Bank’s headquarters in Santa Clara, California and featured CEOs from four EDA companies—Cadence (Lip-Bu Tan), Gradient … Continue reading
Posted in 3D, Apps, EDA360, Silicon Realization, SoC, SoC Realization, System Realization
Tagged 3D, Cadence, EDA, IP, IP Integration, Lego, Low Power, Mentor Graphics, Synopsys
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Friday Video: Multicore, ARM-powered CubeStormer II solved Rubik’s Cube puzzle in world-beating 4.762 seconds
A couple of weeks ago, I posted a video of the ARM-powered CubeStormer II, a robotic mechanism constructed from four Lego Mindstorm NXT kits, that’s purpose-built to unscramble Rubik’s Cubes in the minimum amount of time. The CubeStormer II envelops … Continue reading
Posted in Android, EDA360, Firmware, System Realization
Tagged Bluetooth, Lego, Lego Mindstorm NXT, robotics, Rubik's Cube, Samsung Galaxy
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Friday Video: Rubik’s Cube puzzle solved with Lego Mindstorms robot and… Cadence Incisive Formal Verifier???
Normally, you don’t use a formal verification tool to solve puzzles like Rubik’s Cube and you also don’t normally connect the verification tool to a robot. No, things are usually more cut and dried than that. However, there’s nothing that … Continue reading
Posted in EDA360, System Realization, Verification
Tagged Lego, Lego Mindstorms, robotics, Rubik's Cube
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