Tag Archives: LTE

3D Week: Wide I/O SDRAM, Network on Chip, Multicore, TSV, Asynchronous Logic—3D SoC stack from CEA-Leti and ST-Ericsson hits all the advanced notes. Can you say “Tour de Force”?

Posted on December 14, 2011 by sleibson2

Yesterday, at the RTI 3D Conference, Pascal Vivet from CEA-Leti and Vincent Guérin from ST-Ericsson unveiled a 3D IC project that represents a real Tour de Force of cutting-edge system technology. The quest starts with a key question: “What’s the … Continue reading →

Posted in 3D, ARM, EDA360, Silicon Realization, SoC, SoC Realization, System Realization | Tagged , , , , , , , , | Leave a comment

CNN reviews Droid Bionic 4G handset: “first 4G home run” thanks to some spectacular System Realization

Posted on September 20, 2011 by sleibson2

Jonathan Geller over on the CNN Web site has just published a review of the new Motorola Droid Bionic 4G cellular handset. There are two paragraphs in this review that really caught my eye: “The Bionic is the first Verizon … Continue reading →

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More on the cost of adding LTE to a mobile phone handset. It’s not “just” $39.75. Add at least $10 for the bigger battery.

Posted on July 13, 2011 by sleibson2

Here’s a follow-up to my blog post on the IHS report on the cost of adding LTE to a mobile phone handset. (See “What’s the current cost of adding LTE to a mobile phone? $39.75 says an IHS report.”) I … Continue reading →

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What’s the current cost of adding LTE to a mobile phone? $39.75 says an IHS report.

Posted on July 11, 2011 by sleibson2

According to a report published recently by  the IHS iSuppli Teardown Analysis Service, it costs nearly $40 to add LTE wireless capability to a mobile phone handset. That’s the conclusion of a teardown report on the HTC Thunderbolt mobile phone, … Continue reading →

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Apps-Driven: Microsoft buys Skype for $8.5 billion

Posted on May 10, 2011 by sleibson2

The news that Microsoft has closed a deal to buy Skype for $8.5 billion is all over cyberspace this morning. I found out about it here on gigaom.com. I like Om Malik’s analysis of why this deal is going down. … Continue reading →

Posted in Apps, EDA360, Silicon Realization, SoC Realization, System Realization | Tagged , , , , , , , , | Leave a comment