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- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Friday Video: SoC in tiny 500mg backpack transforms cockroach into radio-controlled exploration vehicle
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- Friday Video: Get the latest skinny on the IPC-2581 open interchange standard for PCB design
- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
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Top Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Ingenious architectural features allow ST to extract maximum performance from new microcontroller family based on ARM Cortex-M4. Cost: less than 6 bucks in 1000s
- Between ASIC and microcontroller: It’s all about System Realization
- EDA360 and the brand new Hewlett-Packard 15C Limited Edition RPN pocket scientific calculator
- What do you do when two processors just won’t do? TI’s OMAP 5 SoCs sport 4-in-hand ARM cores, IP Subsystems
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Tag Archives: Marc Greenberg
3D Thursday: Wide I/O and TSVs have a ripple effect on the DRAM controller. Who knew?
Currently, the JEDEC Wide I/O DRAM specification looks to be the biggest driving force behind the adoption of 3D IC assembly. The 512-bit data maw of a Wide I/O SDRAM provides high bandwidth with low power levels, both excellent arguments … Continue reading
Posted in 2.5D, 3D, DAC, EDA360, IP, Silicon Realization, SoC, SoC Realization, System Realization, TSV, Wide I/O
Tagged DRAM, JEDEC, Marc Greenberg, Mobile device, SDRAM, Wide I/O
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