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- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Friday Video: SoC in tiny 500mg backpack transforms cockroach into radio-controlled exploration vehicle
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- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
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Top Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Ingenious architectural features allow ST to extract maximum performance from new microcontroller family based on ARM Cortex-M4. Cost: less than 6 bucks in 1000s
- ARM Cortex-A15—does this processor IP core need a new category…Superstar IP?
- Are FinFETs inevitable at 20nm? “Yes, no, maybe” says Professor Chenming Hu
- Collaboration is key to making DFM work at 28nm and below
- EDA360 and the brand new Hewlett-Packard 15C Limited Edition RPN pocket scientific calculator
- 3-processor SoC for digital still cameras incorporates an ARM 1136J-S RISC processor core plus separate image and video processors
- The WORD on ARM’s big.LITTLE Cortex-A15/A7 design philosophy from Jack Ganssle, a leading expert and consultant on embedded design and firmware development
- Download a free PDF of the Mixed-signal Methodology Guide, Chapter 1: Design Trends and Challenges
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Tag Archives: Micron Technology
Nikon announces Android-powered camera: the $349 Coolpix S800c
Nikon has just announced an Android-powered point-and-shoot camera—the $349 Coolpix S800c. It’s a 16Mpixel camera with a 10x optical zoom but the real innovation appears on the back in the form of a touch-panel LCD 0.8Mpixel OLED display that is … Continue reading
Posted in Android, ARM, Cortex-A9, EDA360, Linux, Mobile, System Realization
Tagged Android, Camera, CoolpixS800c, Google, Micron Technology, Nikon, Point-and-shoot camera, Wi-Fi
2 Comments
3D Thursday: ARM, HP, and SK hynix join Hybrid Memory Cube Consortium (HMCC)
Add ARM, HP, and SK hynix to the growing list of companies in the Hybrid Memory Cube Consortium (HMCC). The three new members join the original founding companies, Micron and Samsung, along with Altera, IBM, Microsoft, Open-Silicon, and Xilinx plus … Continue reading
Posted in 3D, Memory
Tagged Altera, Hybrid Memory Cube, Hynix, IBM, Micron Technology, Microsoft, Open-Silicon, Samsung, Xilinx
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