Tag Archives: MSA

3D Thursday: 40G and 100G optical Ethernet—Killer 3D app? Perhaps. Compelling? Definitely.

I’ve written several times about Wide I/O DRAM and how its speed and power advantages make it a slam dunk and killer app for 3D IC assembly. I saw another such 3D IC killer app this week at the Ethernet … Continue reading

Posted in 2.5D, 3D, EDA360, Silicon Realization, SoC, SoC Realization, System Realization | Tagged , , , , , , , , | 5 Comments