Search EDA360 Insider
Hey!!! Subscribe now to the EDA360 Insider!
-
Recent Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Friday Video: SoC in tiny 500mg backpack transforms cockroach into radio-controlled exploration vehicle
- Friday Video: A different kind of fab with some very, very cool machines
- Friday Video: Get the latest skinny on the IPC-2581 open interchange standard for PCB design
- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
EDA360 Tag Cloud
- 2.5D
- 3D
- 3D IC
- 20nm
- 28nm
- 32nm
- 40nm
- Agilent
- Altera
- AMD
- Analog
- Android
- Apple
- ARM
- ARM architecture
- ARM Cortex-A15
- ASIC
- Broadcom
- Cadence
- Canon
- Cortex
- Cortex-A15
- Cortex-M0
- DAC
- Dave Jones
- DDR3
- DDR4
- Double Patterning
- EDA
- EDPS
- Field-programmable gate array
- FinFET
- Flash
- Flash memory
- FPGA
- Freescale
- Freescale Semiconductor
- GlobalFoundries
- IBM
- Intel
- IP
- iPad
- iPhone
- JEDEC
- Jim Hogan
- Kinect
- Linux
- Low Power
- Lytro
- microcontroller
- Micron
- Microsoft
- Mixed Signal
- Multi-core processor
- Nvidia
- OrCAD
- pcb
- Printed circuit board
- Qualcomm
- Robot
- Samsung
- SDRAM
- Snapdragon
- SoC
- STMicroelectronics
- SystemC
- Texas Instruments
- TI
- TSMC
- USB
- verification
- video
- Wide I/O
- Xilinx
Top Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Download a free PDF of the Mixed-signal Methodology Guide, Chapter 1: Design Trends and Challenges
- Welcome to 3D Week: Why is 3D important? Now? The memory wall, heat, and disposable sensors
- Want to know more about the Micron Hybrid Memory Cube (HMC)? How about its terabit/sec data rate?
- Intel says Moore’s Law alive and well and living at 32nm
- How do virtual prototyping, emulation, and FPGA prototyping differ? Answers from Frank Schirrmeister
- Friday Video: Want the basics of PCB design in 45 minutes? Dave Jones delivers yet again with a free tutorial.
- Why doesn’t your pc board work?
- Workshop on Analog and Mixed-Signal Design Automation: November 8 in Silicon Valley
- How DAC Got Started: Richard Goering interviews Kaufman Award Winner Pat Pistilli
Download the EDA360 Vision Paper here:
Tag Archives: NAND
Memcon 2012 call for presentation submissions
Memcon 2012 will take place at the Santa Clara Convention Center in the heart of Silicon Valley on Tuesday, September 2012. This is the biggest conference in the world devoted to the use and manufacture of semiconductor memory (RAM, NAND … Continue reading
Posted in EDA360, Memory, Silicon Realization, SoC, SoC Realization, System Realization
Tagged EEPROM, EPROM, Memcon, Memristor, NAND, NOR, RAM
Leave a comment
Flash Memory Summit: Top 10 things you need to know about NAND Flash
An annual panel that now traditionally closes the Flash Memory Summit (held last week in Santa Clara, CA) is Andy Marken’s “Top 10 things you need to know about NAND Flash.” It’s a great way to sum up the events … Continue reading
Posted in EDA360, Memory, Silicon Realization, SoC Realization, System Realization
Tagged Flash, Intel, NAND, SSD, Storcloud
1 Comment
For consumer products, thin is in and NAND Flash is the prescription
References to supermodel Kate Moss aside, the recent Wired Magazine article by Christina Bonnington titled “Future of computing looks thinner” has a distinctly EDA360 tone to it. NAND Flash memory tends to have a slimming effect on the products it … Continue reading
Posted in EDA360, SoC Realization, System Realization
Tagged Flash, NAND, PC, smartphone, tablet
Leave a comment
Is the 1-chip PC looming in the future?
The blog entry I wrote yesterday about the IHS iSuppli report on PCs and ARM processors set me on a thought path about PC design. (See “IHS iSuppli predicts that ARM CPUs will grab 25% of the PC market by … Continue reading
Posted in ARM, EDA360, Memory, Silicon Realization, SoC Realization, System Realization
Tagged CPU, Flash, HDD, NAND, PC
Leave a comment
Toshiba, SanDisk break 20nm barrier with 19nm NAND Flash
Memories now drive process technology and NAND Flash is the current main driver. So it’s no surprise that NAND Flash memories are the first to be produced at a process node below 20nm, which is precisely what Toshiba and SanDisk … Continue reading
EDA360 Insider 