Tag Archives: Open-Silicon

3D Thursday: ARM, HP, and SK hynix join Hybrid Memory Cube Consortium (HMCC)

Add ARM, HP, and SK hynix to the growing list of companies in the Hybrid Memory Cube Consortium (HMCC). The three new members join the original founding companies, Micron and Samsung, along with Altera, IBM, Microsoft, Open-Silicon, and Xilinx plus … Continue reading

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3D Thursday: Hybrid Memory Cube—wide I/O only more so—gets an industry consortium

Back in August, I wrote about the 3D SDRAM assembly called the Micron Hybrid Memory Cube (HMC, see “Want to know more about the Micron Hybrid Memory Cube (HMC)? How about its terabit/sec data rate?”) and I called it a … Continue reading

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Open-Silicon’s Naveed Sherwani speaks about the verification crisis in SoC design with unusual clarity

Last month at DAC, Richard Goering interviewed Open-Silicon CEO Naveed Sherwani for ChipEstimate.tv. The main topic was Open-Silicon’s new “on time or on us” chip delivery program but the last few minutes of the 11-minute video interview cover the very … Continue reading

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How do you get a processor to tape out at 2.4 GHz? Silicon Realization

In the ramp-up to CDNLive! India this week, ASIC- and chip-design house Open-Silicon announced today that it has successfully taped out a processor design that will run at 2.4GHz using the end-to-end Cadence Silicon Realization product line. “We have fine … Continue reading

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