Tag Archives: packaging

3D Thursday: Electronics Component and Technologies Conference in San Diego features several 3D learning opportunities. May 29-June 1.

The Electronics Component and Technologies Conference being held in San Diego on May 29-June 1 will provide you with several significant opportunities to come up to speed on 3D IC assembly and related topics including: Session 1 on 3D Interconnect … Continue reading

Posted in 2.5D, 3D, EDA360, Packaging, Silicon Realization, SoC, SoC Realization, System Realization | Tagged , , , | Leave a comment

3D Week: The three interconnect crises of the electronics industry and the inevitability of 3D. Believable?

Many people in the electronics industry view 3D IC assembly as not being in the mainstream. That’s easy to understand. It’s not at the moment. Yet I do believe in the inevitability of 3D assembly. Here’s why. At last week’s … Continue reading

Posted in 2.5D, 3D, EDA360, Silicon Realization, SoC, SoC Realization, System Realization | Tagged , , , | Leave a comment