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- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Friday Video: SoC in tiny 500mg backpack transforms cockroach into radio-controlled exploration vehicle
- Friday Video: A different kind of fab with some very, very cool machines
- Friday Video: Get the latest skinny on the IPC-2581 open interchange standard for PCB design
- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
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Top Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Ingenious architectural features allow ST to extract maximum performance from new microcontroller family based on ARM Cortex-M4. Cost: less than 6 bucks in 1000s
- ARM drops Cortex-A7 core on unsuspecting market, devastates low-power SoC and application-processor landscapes. What’s it all mean?
- 3D Thursday: More on the Xilinx Virtex 7 with 2.5D tiling. Wave of the future or stopgap measure?
- Microprocessor Report publishes extremely interesting comparison of STMicroelectronics SPEAr-1300 and Xilinx Zynq ARM-based, dual core application processors
- ARM adds ARM Cortex-A15 and Cortex-R5 models to Fast Models 6.1 release, making these cores immediately available to System Realization teams
- 3D Thursday: How Xilinx developed a 2.5D strategy for making the world’s largest FPGA and what the company might do next with the technology
- Friday Video: Ready for a little mobile phone teardown archaeology? Dave Jones compares state of the art in 1994 (Motorola) with an evolved 2000 (Nokia)
- Want details on the TSMC 20nm process technology?
- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
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Tag Archives: Reiter
Friday Video: Mr. 3D IC, Herb Reiter, speaks about his start with 3D, where it is, where it’s going
I conducted this video interview with Herb Reiter, “Mr. 3D IC” and president of eda2asic, the day after he spoke at a MEPTEC lunch in Silicon Valley—see “3D Thursday: The “King of 3D ICs” (Herb Reiter) speaks to his subjects—‘Learn … Continue reading
3D Thursday: The “King of 3D ICs” (Herb Reiter) speaks to his subjects—“Learn to work together”
Mr. 3D IC—aka Herb Reiter—spoke to an attentive group of packaging experts about the state of 3D IC technical and business development today at a MEPTEC luncheon held at the “luxurious” Biltmore Hotel in cental Silicon Valley. I’ve written about … Continue reading
Posted in 2.5D, 3D, DAC, EDA360, Low Power, Packaging, Silicon Realization, SoC, SoC Realization, System Realization, Wide I/O
Tagged 2.5D, 3D, Herb Reiter, IBM, Reiter, Three-dimensional integrated circuit, TSMC, Xilinx
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