Tag Archives: Sematech

Friday Video: Mr. 3D IC, Herb Reiter, speaks about his start with 3D, where it is, where it’s going

Posted on June 15, 2012 by sleibson2

I conducted this video interview with Herb Reiter, “Mr. 3D IC” and president of eda2asic, the day after he spoke at a MEPTEC lunch in Silicon Valley—see “3D Thursday: The “King of 3D ICs” (Herb Reiter) speaks to his subjects—‘Learn … Continue reading →

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3D Thursday: SEMATECH wades in to develop assessment criteria for 3D manufacturing equipment and processes

Posted on January 19, 2012 by sleibson2

Earlier this week, SEMATECH—the global semiconductor industry’s research consortium—announced that it plans to conduct “Equipment Maturity Assessments (EMAs) of several critical 3D tools during 2012 to establish functional equipment capabilities and address high-volume manufacturing maturity issues” through its wholly owned … Continue reading →

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3D Thursday: Where can you start with 3D?

Posted on November 10, 2011 by sleibson2

My first panelist to speak on last week’s 3D IC panel at the 9th International SoC Conference in Newport Beach was Herb Reiter, generally known as “Mr. 3D.” Herb knows everyone in the industry connected to anything 3D. He’s been … Continue reading →

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