Tag Archives: SerDes

3D Thursday: The low down on low-power CPU-memory connections from EDPS

Earlier this month at EDPS, Marc Greenberg, Director of Product Marketing for the Cadence Design IP Group, said that Wide I/O SDRAM memory was going to drive the earliest adoption of 3D IC assembly techniques. Not simply because Wide I/O … Continue reading

Posted in 2.5D, 3D, EDA360, Memory, Packaging, Silicon Realization, SoC, SoC Realization, System Realization, Wide I/O | Tagged , , | Leave a comment

Cadence announces synthesizable 40G and 100G Ethernet Controller, PCS, and BEAN (Backplane Ethernet Auto-Negotiation) IP

In conjunction with this week’s Ethernet Technology Summit being held in San Jose, Cadence has announced commercial availability of MAC (Media Access Control), PCS (Physical Coding Sublayer) and BEAN (Backplane Ethernet Auto-Negotiation) IP blocks. The 40/100G MAC controller is fully … Continue reading

Posted in EDA360, Silicon Realization, SoC, SoC Realization | Tagged , , , , , , , , , , | Leave a comment

3D Thursday: How Xilinx developed a 2.5D strategy for making the world’s largest FPGA and what the company might do next with the technology

Two weeks ago, I moderated a 3D IC panel at the 9th International SoC Conference in Newport Beach, California. Last week, I wrote about the first two speakers. (See “3D Thursday: Where can you start with 3D?” and “3D Thursday: … Continue reading

Posted in 2.5D, 28nm, 3D, 65nm, Silicon Realization, SoC, SoC Realization, TSV | Tagged , , , , | 2 Comments