Tag Archives: Sigrity

3D Thursday: What the Cadence purchase of signal- and power-integrity EDA toolmaker Sigrity means for 2.5D and 3D IC assembly

Richard Goering has just published an in-depth analysis in his Industry Insights blog that explains what the Cadence purchase of signal- and power-integrity EDA toolmaker Sigrity means for pcb and IC package designers. Goering quotes Brad Griffin, product marketing director … Continue reading

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