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Top Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Download a free PDF of the Mixed-signal Methodology Guide, Chapter 1: Design Trends and Challenges
- Welcome to 3D Week: Why is 3D important? Now? The memory wall, heat, and disposable sensors
- Want to know more about the Micron Hybrid Memory Cube (HMC)? How about its terabit/sec data rate?
- Intel says Moore’s Law alive and well and living at 32nm
- How do virtual prototyping, emulation, and FPGA prototyping differ? Answers from Frank Schirrmeister
- Friday Video: Want the basics of PCB design in 45 minutes? Dave Jones delivers yet again with a free tutorial.
- Why doesn’t your pc board work?
- Workshop on Analog and Mixed-Signal Design Automation: November 8 in Silicon Valley
- How DAC Got Started: Richard Goering interviews Kaufman Award Winner Pat Pistilli
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Tag Archives: SOI
IBM to manufacture 32nm SOI chips with eDRAM in new GLOBALFOUNDRIES Fab 8 (Malta, NY)
IBM is the first announced customer for GLOBALFOUNDRIES’ Fab 8 in Malta, NY. The companies plan to manufacture IBM’s 32nm SOI devices at the site using an SOI process technology. The new plant has already been facilitized with more than … Continue reading
Posted in 32nm, EDA360, Silicon Realization
Tagged 32nm, eDRAM, GlobalFoundries, IBM, SOI
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Power, Performance, Cost. FDSOI lets you pick any three. Want proof? How about an ARM Cortex-M0 processor core example?
Last week, the first session of the International SoC Conference focused on FDSOI (fully depleted silicon-on-insulator) IC fabrication. Now if your thinking resembles mine before I watched this presentation, you think that FDSOI is an advanced IC-fabrication process that gives … Continue reading
Posted in 20nm, ARM, Cortex-M0, FDSOI, Silicon Realization, SoC, SoC Realization
Tagged ARM, Cortex-M0, FDSOI, M0, SOI
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What can you do with 45nm SOI? A lot, it turns out
Cadence just published a story about working with IBM on developing advanced Spice-level simulation models for IBM’s advanced SOI (silicon on insulator) IC processes to achieve better correlation between the circuit simulation results and the actual silicon. Now you only … Continue reading
Posted in ARM, EDA360, Silicon Realization
Tagged IBM, Nintendo, SOI, Spice, Watson, Wii
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