Tag Archives: sSilicon

3D Thursday: Who is responsible for successful 2.5D and 3D assembly? eSilicon is perhaps saying “Us”

Two weeks ago, I moderated a 3D IC panel at the 9th International SoC Conference in Newport Beach, California. Last week, I wrote about the first two speakers. (See “3D Thursday: Where can you start with 3D?” and “3D Thursday: … Continue reading

Posted in 2.5D, 3D, EDA360, Silicon Realization, SoC, SoC Realization | Tagged , , , | Leave a comment