Tag Archives: stacked silicon

3D Thursday (Late): Sony to invest 80 billion Yen in stacked CMOS sensor manufacturing expansion

Posted on June 22, 2012 by

Quoting a corporate press release, the Web site http://www.dpreview.com reports that Sony Corp intends to invest approximately 80 billion Yen through the end of March, 2014 to expand its capacity to manufacture “stacked silicon sensors,” which are 3D IC assemblies … Continue reading →

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