Search EDA360 Insider
Hey!!! Subscribe now to the EDA360 Insider!
-
Recent Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Friday Video: SoC in tiny 500mg backpack transforms cockroach into radio-controlled exploration vehicle
- Friday Video: A different kind of fab with some very, very cool machines
- Friday Video: Get the latest skinny on the IPC-2581 open interchange standard for PCB design
- Smartphones: Where PCIe has not gone before—but will. Sooner rather than later.
EDA360 Tag Cloud
- 2.5D
- 3D
- 3D IC
- 20nm
- 28nm
- 32nm
- 40nm
- Agilent
- Altera
- AMD
- Analog
- Android
- Apple
- ARM
- ARM architecture
- ARM Cortex-A15
- ASIC
- Broadcom
- Cadence
- Canon
- Cortex
- Cortex-A15
- Cortex-M0
- DAC
- Dave Jones
- DDR3
- DDR4
- Double Patterning
- EDA
- EDPS
- Field-programmable gate array
- FinFET
- Flash
- Flash memory
- FPGA
- Freescale
- Freescale Semiconductor
- GlobalFoundries
- IBM
- Intel
- IP
- iPad
- iPhone
- JEDEC
- Jim Hogan
- Kinect
- Linux
- Low Power
- Lytro
- microcontroller
- Micron
- Microsoft
- Mixed Signal
- Multi-core processor
- Nvidia
- OrCAD
- pcb
- Printed circuit board
- Qualcomm
- Robot
- Samsung
- SDRAM
- Snapdragon
- SoC
- STMicroelectronics
- SystemC
- Texas Instruments
- TI
- TSMC
- USB
- verification
- video
- Wide I/O
- Xilinx
Top Posts
- A head-to-head comparison of the ARM Cortex-M4 and –M0 processor cores by Jack Ganssle
- Download a free PDF of the Mixed-signal Methodology Guide, Chapter 1: Design Trends and Challenges
- After Silicon, SoC, and System Realization comes Dynasty Realization
- 3D Thursday: Intel and FinFETs (Tri-Gate transistors)—a different kind of 3D
- 3D Thursday: Micron to present Hybrid Memory Cube status at EDPS in Monterey, April 6—there’s a lot of news
- Ingenious architectural features allow ST to extract maximum performance from new microcontroller family based on ARM Cortex-M4. Cost: less than 6 bucks in 1000s
- 3D Thursday: How Xilinx developed a 2.5D strategy for making the world’s largest FPGA and what the company might do next with the technology
- Friday Video: How many hardware/software integration lessons can you absorb in 34 minutes?
- ARM Cortex-A15—does this processor IP core need a new category…Superstar IP?
- Is the Common Platform Alliance a credible competitor to TSMC?
Download the EDA360 Vision Paper here:
Tag Archives: SystemVerilog
Need a better way to visualize and track verification metrics? Learn how this Wednesday. Free.
You have only hours to sign up for a free Webinar on using the Cadence Incisive Metric Center taking place this coming Wednesday at noon (US Eastern Time). “What’s that?” you might ask. The Incisive Metrics Center simplifies the way … Continue reading
Four Significant EDA technologies of 2011 and what they mean to your IC design team
This week, Cadence celebrated the efforts of several developers who have created some very innovative technology during a private award ceremony. The reason I’m mentioning this internal event at all is because these celebrated technologies are already having a profoundly … Continue reading
FREE Webinar on analog verification. Wednesday, May 9 at 9:00 am PST
Analog blocks are usually verified at the block level many things still go wrong with connectivity and control of the analog circuit at the SoC level. It’s not enough to integrate these analog blocks into digital simulations; you need to … Continue reading
Posted in Analog, EDA360, Mixed Signal, Silicon Realization, Verification
Tagged AMS, Analog, Mixed Signal, SV-AMS, SystemVerilog, verification
Leave a comment
Free Webinar teaches you how to mix C, C++, SystemC, and SystemVerilog verification models within UVM—October 20
Our world is filled with mixed verification models and that fact isn’t going to change soon. If you would like to learn how to efficiently combine mixed verification models to work within the Accelera Universal Verification Methodology (UVM), then there’s … Continue reading
Posted in System Realization, SystemC, UVM, Verification
Tagged Accelera, SystemC, SystemVerilog, TLM, UVM
Leave a comment
Grant Martin book review: “TLM-Driven Design and Verification Methodology”
My good friend Grant Martin has written a ton of books, book chapters, and articles about a wide range of EDA topics and he often reviews related books. He’s just published a review of the new book “TLM-Driven Design and … Continue reading
Posted in EDA360, Silicon Realization, SoC Realization, System Realization
Tagged Specman, SystemVerilog
1 Comment
EDA360 Insider 