Tag Archives: Tezzaron

3D Thursday: Want some real-world insight into 2.5D and 3D IC design and assembly? Read on to get the word from Tezzaron Semiconductor

Ann Steffora-Mutschler just published an interview with Robert Patti, chief technology officer at Tezzaron Semiconductor, that gives some terrific technical detail about 2.5D and 3D IC design and assembly. Patti provides some rare insight into today’s (as in right now) … Continue reading

Posted in 2.5D, 3D, EDA360, Silicon Realization, SoC, SoC Realization, System Realization | Tagged , , | Leave a comment