Tag Archives: Through-silicon via

3D Thursday: Produce cost-effective 2.5D and 3D devices. Attend the Known Good Die conference, November 15

Robert Patti, Chief Technical Officer and VP of Design Engineering at Tezzaron Semiconductor is the just-announced speaker at the Known Good Die conference being held on November 15 in Santa Clara, CA. His topic: Using Repair & Redundancy with KGD … Continue reading


Posted in 2.5D, 3D, EDA360, Silicon Realization | Tagged , , , | Leave a comment

3D Thursday: GLOBALFOUNDRIES adds TSV capability for 28nm and 20nm die to Fab 8 in Saratoga County, New York

Customers’ clamor for 3D IC assembly capability and die with TSVs (through-silicon vias) has apparently gotten loud enough to cause a change of game plan for GLOBALFOUNDRIES, which announced today that it is spending “tens of millions of dollars” to … Continue reading

Posted in 20nm, 28nm, 3D, EDA360, Globalfoundries, Silicon Realization, SoC, SoC Realization, TSV | Tagged , , , , , , | Leave a comment